GEL-PAK TO PARTICIPATE IN FORMFACTOR COMPASS EVENT IN TOKYO, JAPAN FEB 12, 2025 Posted on February 10, 2025 (February 10, 2025) HAYWARD, CA January 08, 2025 Gel-Pak, a Delphon company and a worldwide leader in cutting-edge materials and protective carriers for photonic devices, is excited to announce its participation in the upcoming FormFactor COMPASS event in Tokyo, Japan, on February 12, 2025. This year’s event, themed “Bringing Tomorrow’s Technology to Life,” will showcase the latest advancements […]Read More… from GEL-PAK TO PARTICIPATE IN FORMFACTOR COMPASS EVENT IN TOKYO, JAPAN FEB 12, 2025
Mitigating the High Cost of Product Defects Posted on January 14, 2025 (January 20, 2025) Associated with Shipping and Handling Thin Microwave Devices The march of technological progress continues as traditionally bulky and discrete microwave devices become integrated in increasingly smaller microelectronic modules and packages. New high performance GaN, GaAs, InP and other Class III-V and silicon semiconductor devices, along with high performance silicon variations such as SiC, are designed […]Read More… from Mitigating the High Cost of Product Defects
Protecting the Future: How Gel-Pak Safeguards Google’s Willow Quantum Computing Chip Posted on January 8, 2025 (January 14, 2025) In the realm of quantum computing, Google’s Willow chip represents a significant leap forward. This chip, known for its advanced error correction and immense computational power, has demonstrated performance that paves the way for more advanced, large-scale quantum computing. Willow can solve problems in five minutes that would take the fastest supercomputers 10 septillion years. […]Read More… from Protecting the Future: How Gel-Pak Safeguards Google’s Willow Quantum Computing Chip
GEL-PAK TO SHOWCASE INNOVATIONS IN PHOTONIC DEVICE HANDLING AT PHOTONICS WEST 2025 Posted on January 8, 2025 (January 14, 2025) HAYWARD, CA January 08, 2025 Company Leverages Extensive Collaborations with Photonics Industry Leaders to Address Evolving Market Requirements for Device Handling and Protection Gel-Pak, a Delphon company and a worldwide leader in cutting-edge materials and protective carriers for photonic devices, today announced it will demonstrate its latest product breakthroughs for the photonics market at the […]Read More… from GEL-PAK TO SHOWCASE INNOVATIONS IN PHOTONIC DEVICE HANDLING AT PHOTONICS WEST 2025
Gel-Pak Expands U.S. Sales Presence with New Manufacturers’ Representatives Posted on November 20, 2024 (November 21, 2024) HAYWARD, CA November 20, 2024 Gel-Pak, a division of Delphon and a global leader in protective carriers and films for semiconductor, optoelectronic, and medical devices, is pleased to announce the expansion of its U.S. sales presence with the addition of two new Manufacturers’ Representatives. Engineering Solutions-West (ES-West), based in Santa Clara, CA, will help serve […]Read More… from Gel-Pak Expands U.S. Sales Presence with New Manufacturers’ Representatives
Victoria Tran And Tomonao Nakashima Present Joint Paper On Cleaning Innovations To Maximize OEE For High Volume Memory Test Posted on October 24, 2024 (November 21, 2024) HAYWARD, CA October 24, 2024 Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, is proud to announce that Dr. Victoria Tran, Delphon R&D Director and Tomonao Nakashima, Chief Manager of Product Engineering at JEM (Japan Electronic Materials), will deliver a joint presentation titled “Cleaning Innovations to […]Read More… from Victoria Tran And Tomonao Nakashima Present Joint Paper On Cleaning Innovations To Maximize OEE For High Volume Memory Test
Dr. Jerry Broz to Speak at IS-Test Workshop in Munich Posted on September 4, 2024 (November 8, 2024) HAYWARD, CA September 4, 2024 Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, is proud to announce that Dr. Jerry Broz, VP of Business Development and Strategic Marketing, will speak at the prestigious ITWS – IS-Test Workshop. The event will take place on September 16-17, 2024, […]Read More… from Dr. Jerry Broz to Speak at IS-Test Workshop in Munich
Silicon Carbide Materials Present Unique Shipping Requirements Posted on June 15, 2024 (November 8, 2024) Whether shipped as processed wafers, singulated die or fully packaged modules, all semiconductors have special transport requirements. Without the right carriers, they can easily become damaged. Each new material and substrate type poses new handling challenges. A prime example is compound semiconductors. Implementation of these devices is on the rise due to their wide bandgap, […]Read More… from Silicon Carbide Materials Present Unique Shipping Requirements
Delphon Announces appointment of Bruce Potvin as vice president, Sales and Marketing Posted on May 13, 2024 (November 8, 2024) HAYWARD, CA May 13, 2024 Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and electronics industries, today announced the appointment of Bruce Potvin as Vice President, Sales and Marketing. He will replace long time Vice President of Sales and Marketing Darby Davis, who will be transitioning to a […]Read More… from Delphon Announces appointment of Bruce Potvin as vice president, Sales and Marketing
Gel-Pak Names S.E.R. Corporation As Japanese Distributor For The Gel-Probe™ Product Line Posted on April 22, 2024 (November 8, 2024) HAYWARD, CA April 22, 2024 Gel-Pak, a Delphon company and a worldwide leader in elastomer-based materials and protective carriers for the semiconductor, medical, and electronics industries has announced today the appointment of S.E.R. Corporation, Tokyo, as its Japan distributor for the Gel-Probe™ product line. S.E.R. Corporation, a global supplier of customized connectors, semiconductor test products, […]Read More… from Gel-Pak Names S.E.R. Corporation As Japanese Distributor For The Gel-Probe™ Product Line
Gel-Pak’s Gel-Probe Qualified By Top Semiconductor Industry Probe Card Manufacturers Posted on March 25, 2024 (November 8, 2024) HAYWARD, CA March 25, 2024 Gel-Pak, a Delphon Industries company and global leader in elastomer-based materials and protective carriers for the semiconductor, medical, and electronics industries, proudly announces the successful qualification of its Gel-Probe product line by several of the semiconductor industry’s top tier probe card manufactures. Gel-Pak has worked collaboratively with the industry’s leading […]Read More… from Gel-Pak’s Gel-Probe Qualified By Top Semiconductor Industry Probe Card Manufacturers
Gel-Pak Announces New Gel-Probe™ Product Line Posted on February 1, 2024 (November 8, 2024) HAYWARD, CA February 1, 2024 Gel-Pak, a Delphon company and a global leader in elastomer-based materials and protective carriers for the semiconductor, medical, and electronics industries, is pleased to announce the launch of its Gel-Probe products. This new line features enhanced probe tip cleaning and polishing solutions designed for semiconductor test applications. In the late […]Read More… from Gel-Pak Announces New Gel-Probe™ Product Line
Delphon Announces Appointment Of Jerry Broz, PhD, To Vice President, Strategic Marketing & Business Development Posted on September 27, 2023 (November 8, 2024) HAYWARD, CA September 27, 2023 Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and electronics industries, today announced the appointment of Jerry Broz, PhD, as Vice President, Strategic Marketing & Business Development. Dr. Broz will serve as technical lead for Delphon’s new product initiatives. He will also be […]Read More… from Delphon Announces Appointment Of Jerry Broz, PhD, To Vice President, Strategic Marketing & Business Development
Collaboration: The Engine that Drives Innovation Posted on April 26, 2023 (November 8, 2024) By Joe Montano, President and CEO, Delphon “Great things in business are never done by one person; they’re done by a team of people.” Few in our industry would argue against this maxim, attributed to Steve Jobs. The reality is that true innovation is achieved not by one team but by multiple teams, leveraging each […]Read More… from Collaboration: The Engine that Drives Innovation
Delphon Appoints Pradeep Mishra As Vice President, Manufacturing Operations Posted on April 19, 2023 (November 8, 2024) HAYWARD, CA April 19, 2023 Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and electronics industries, today announced the appointment of Pradeep Mishra to the role of Vice President, Manufacturing Operations. In his new role, Pradeep will lead Delphon’s Operations activities related to Manufacturing, Engineering, Supply Chain, Logistics, […]Read More… from Delphon Appoints Pradeep Mishra As Vice President, Manufacturing Operations
Gel-Pak showcases component handling solutions for military and space applications at the components for military and space electronics conference in los angeles, ca april 25-27 Posted on March 2, 2023 (September 5, 2023) HAYWARD, CA Janury 18, 2023 FOR IMMEDIATE RELEASE – JANUARY 25, 2023 Gel-Pak, a Delphon company and a worldwide leader in cutting-edge materials and protective carriers for advanced technologies, today announced it will showcase its custom Silicone, TPU, and TPE film extrusion and coating capabilities along with its biocompatible carriers for the medical device industry […]Read More… from Gel-Pak showcases component handling solutions for military and space applications at the components for military and space electronics conference in los angeles, ca april 25-27
Gel-Pak to showcase it’s customized silicone, TPU, and TPE films and it’s biocompatible device carriers at MD&M West Posted on January 25, 2023 (September 5, 2023) FOR IMMEDIATE RELEASE – JANUARY 25, 2023 Gel-Pak, a Delphon company and a worldwide leader in cutting-edge materials and protective carriers for advanced technologies, today announced it will showcase its custom Silicone, TPU, and TPE film extrusion and coating capabilities along with its biocompatible carriers for the medical device industry at the IME MD&M West […]Read More… from Gel-Pak to showcase it’s customized silicone, TPU, and TPE films and it’s biocompatible device carriers at MD&M West
Chiplets’ Day Is Here, but Their Ecosystem Is Still Evolving Posted on January 19, 2023 (September 6, 2023) In the post-Moore’s Law era, chiplets – whose future implementation Gordon Moore also predicted – are expected to deliver high performance and area utilization, together with low power consumption and cost. Conceptually similar solutions, such as multi-chip modules and systems-on-chip, have been around for many years. The chiplet takes this concept a step further, creating […]Read More… from Chiplets’ Day Is Here, but Their Ecosystem Is Still Evolving
Gel-Pak brings 40 years of device handling expertise to Photonics West; will showcase latest innovations for protecting valuable photonics components Posted on January 18, 2023 (September 5, 2023) Company Leverages Extensive Collaborations with Photonics Industry Leaders to Address Evolving Market Requirements for Device Handling and Protection HAYWARD, CA Janury 18, 2023 Gel-Pak, a Delphon company and a worldwide leader in cutting-edge materials and protective carriers for photonic devices, today announced it will demonstrate its latest material breakthroughs for the photonics market at Photonics […]Read More… from Gel-Pak brings 40 years of device handling expertise to Photonics West; will showcase latest innovations for protecting valuable photonics components
Keeping Delicate Medical Devices Safe During Handling and Shipping Posted on December 20, 2022 (September 6, 2023) Today’s medical devices often integrate delicate ICs or MEMS, or require incredibly small, intricate components. Advances in manufacturing allow design and fabrication of parts with fine resolution, down to micron-sized features. Such small feature sizes create key challenges for handling, inspection, sorting, and shipping these components. MEMS, with their combination of electronic and mechanical features […]Read More… from Keeping Delicate Medical Devices Safe During Handling and Shipping
Shipping and Handling of Planar Lightwave Circuits (PLC) Posted on October 12, 2022 (November 22, 2024) By the definition, the fragile and highly polished Planar Lightwave Circuits (PLC) are difficult to operate with without any damages or scratches. Gel-Pak VR tray technology faced the challenge and was able not just outperformed the most common for industry Waffle Packs, but provided to the total exclusion of the possibility of damages during the […]Read More… from Shipping and Handling of Planar Lightwave Circuits (PLC)
Shipping GaAs for Power Amplifier Posted on October 12, 2022 (November 22, 2024) Application: One of the Asia’s premier GaAs foundries, offering high speed GaAs MMIC’s (monolithic microwave ICs) and RFIC’s (radio frequency ICs) had been working to get their PA (power amplifier) chips qualified by a leading US semiconductor manufacturer for use in Apple’s iPhone products. The GaAs foundry was required to make several large shipments of […]Read More… from Shipping GaAs for Power Amplifier
Optical Sub-Assembly Handling During Manufacturing Posted on October 12, 2022 (November 22, 2024) Application: The world’s largest supplier of optical communication products required a special carrier for their small Optical Sub-Assembly (OSA) manufacturing process. Their OSA device, which is comprised of many small, fragile passive and active components, is a high-end product that enables 100GHz infrastructure. The company reached out to Gel-Pak in search of a device carrier […]Read More… from Optical Sub-Assembly Handling During Manufacturing
Shipping and Handling Multi-binned IC’s Posted on October 12, 2022 (November 22, 2024) Overview The R&D department of one of the largest global semiconductor companies,specializing in a broad range of analog and digital connectivity products was experiencing high levels of scrap and low yields when shipping several of its IC chip products. They shipped multi-binned IC’s that ranged in size from 1x1mm up to 10x10mm with thickness dimensions […]Read More… from Shipping and Handling Multi-binned IC’s
Protecting Valuable Inkjet Print Heads During Shipping and Handling Posted on October 12, 2022 (November 22, 2024) Overview A leading manufacturer of high-value industrial inkjet print heads needed a method of securing and immobilizing print head components during shipping and handling. The company needed a carrier for three different components that comprised the print head. The average cost of each component was about $6,000 so it was important that the carrier provided […]Read More… from Protecting Valuable Inkjet Print Heads During Shipping and Handling
Gel-Pak to showcase biocompatible device carriers at the compamed trade fair in Dusseldorf, Germany November 14-17, 2022 Posted on September 6, 2022 (September 6, 2023) HAYWARD, CA September 6, 2022 Gel-Pak, a Delphon company and worldwide leader in protective carriers for medical, semiconductor and photonic devices will showcase its biocompatible device handling solutions at the Compamed Trade Fair in Dusseldorf, Germany November 14-17, 2022. Gel-Pak develops and manufactures a family of biocompatible, elastomer-based carriers and films designed to provide maximum […]Read More… from Gel-Pak to showcase biocompatible device carriers at the compamed trade fair in Dusseldorf, Germany November 14-17, 2022
Senate Votes to Advance Bill to Subsidize U.S.-Made Semiconductor Chips Posted on July 27, 2022 (December 19, 2022) By Amy B Wang and Jeanne Whalen The Senate voted Tuesday to advance a bill that would provide $52 billion in subsidies to domestic semiconductor manufacturers, as well as invest billions in science and technology innovation, in a bid to strengthen the United States’ competitiveness and self-reliance in what is seen as a keystone industry […]Read More… from Senate Votes to Advance Bill to Subsidize U.S.-Made Semiconductor Chips
New Micro-textured Film Enables Universal Bare Die Carrier Posted on July 8, 2022 (December 16, 2022) By Raj Varma, Delphon CTO Jul 8, 2022 Gel-Pak’s new micro-textured film is featured in an article published in the July issue of Silicon Semiconductor The emerging chiplet trend, which calls for the disaggregation of large monolithic functionality into interconnected smaller dies, offers significant advantages over the alternative system on chip (SoC). The move toward […]Read More… from New Micro-textured Film Enables Universal Bare Die Carrier
Lid Clip System Stops Thin Semiconductor Die from Migrating Posted on June 13, 2022 (November 8, 2024) By Gel-Pak, Hayward, Calif. Jun 13, 2022 Gel-Pak’s New LCS2™ is Featured in the June Issue of Microwave Journal Compound semiconductor die are getting thinner, and standard waffle packs aren’t designed to contain them. The result is die migration, resulting in higher cost from yield loss, rework labor and returned material to suppliers. Gel-Pak® and […]Read More… from Lid Clip System Stops Thin Semiconductor Die from Migrating
Semiconductors In the Time of Covid Posted on June 7, 2022 (November 8, 2024) By Ron Iscoff, Editor in Chief Tap Times Jun 7, 2022 Delphon’s CEO, Joe Montano discusses the unprecedented market dynamics brought on by the COVID pandemic in the May/June issue of Tap Times. Semiconductors In the Time of Covid In pre-COVID days, predicting where the semiconductor industry was headed wasn’t necessarily easy, but it was […]Read More… from Semiconductors In the Time of Covid
Gel-pak showcases new product platforms at international microwave symposium in Denver, CO Posted on June 3, 2022 (September 6, 2023) HAYWARD, CA June 3, 2022 Gel-Pak, a Delphon company and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, will showcase its new Lid Clip Super System LCS2TM, Polyurethane Device Carrier, and Texturized Film JEDEC Carrier at the International Microwave Symposium in Denver, CO June 21-23, 2022. Craig Blanchette, Sr. Process Engineer at […]Read More… from Gel-pak showcases new product platforms at international microwave symposium in Denver, CO
Robots Pick Up More Work at Busy Factories Posted on May 29, 2022 (November 8, 2024) By Bob Tita, The Wall Street Journal May 29, 2022 Delphon Featured in Wall Street Journal Article Robots are turning up on more factory floors and assembly lines as companies struggle to hire enough workers to fill rising orders. Orders for workplace robots in the U.S. increased by a record 40% during the first quarter […]Read More… from Robots Pick Up More Work at Busy Factories
Executive interview: Joe Montano, president and CEO, DELPHON Posted on May 1, 2022 (December 16, 2022) 1. What is the focus of Delphon and what are the core competencies that differentiate the company from its competitors? At Delphon, we’ve carefully curated a portfolio of companies that develop and deliver highly engineered materials for the semiconductor, medical, photonics and electronic industries. We are not done adding to the current portfolio and are […]Read More… from Executive interview: Joe Montano, president and CEO, DELPHON
Gel-Pak to showcase new microtextured device carrier at the international conference & exhibition on device packaging Posted on February 10, 2022 (November 8, 2024) Hayward, CA February 10, 2022 Gel-Pak, a Delphon company and worldwideleader in protective carriers for semiconductor, photonics, and medical devices, will showcase its new micro textured device carrier at the International Conference & Exhibition on Device Packaging in Phoenix, AZ March 7-9. Inspired by Gecko fibril microstructures, Gel-Pak has developed a unique micro texture to […]Read More… from Gel-Pak to showcase new microtextured device carrier at the international conference & exhibition on device packaging
Gel-Pak to showcase new microtextured device carrier at photonics west Posted on January 12, 2022 (November 8, 2024) Hayward, CA January 12, 2022 Gel-Pak, a Delphon company and worldwide leader in protective carriers for optoelectronic devices, will showcase its new micro textured device carrier at Photonics West from January 25-27 in San Francisco, CA. Gel-Pak’s new TXF film carrier uses a unique micro texture to secure and protect fragile photonic devices using non-adhesive […]Read More… from Gel-Pak to showcase new microtextured device carrier at photonics west
Delphon Announces Transition of Joseph Montano to Chief Executive Officer Posted on January 4, 2022 (September 7, 2023) Hayward, CA, January 4, 2022 Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and electronics industries, today announced the transition of Joe Montano from President to President and Chief Executive Officer. Effective January 1, 2022, Joe will be responsible for Delphon’s overall operations and for leading the company […]Read More… from Delphon Announces Transition of Joseph Montano to Chief Executive Officer
Delphon Appoints Thaddeus Ericson as Corporate Chief Financial Officer Posted on November 30, 2021 (November 8, 2024) Hayward, CA, November 30, 2021 Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and electronics industries, announced today the appointment of Thaddeus (Tad) Ericson as Chief Financial Officer. Tad is a seasoned executive with extensive experience in leading high-growth organizations in the industrial and electronic materials industries. As […]Read More… from Delphon Appoints Thaddeus Ericson as Corporate Chief Financial Officer
Eliminate Costly Component Out Of Pocket Defect Condition Posted on October 10, 2021 (December 16, 2022) Hayward, CA October 10, 2021 AT IMAPS INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor and optoelectronic devices and BAE Systems, a global military electronics manufacturer, will present a paper titled Eliminating Costly Component Out of Pocket Defect Condition During Semiconductor IC Transport/Handing at the IMAPS […]Read More… from Eliminate Costly Component Out Of Pocket Defect Condition
Gel-Pak named finalist in San Francisco East Bay’s innovation awards Posted on October 1, 2021 (December 16, 2022) Hayward, CA October 1, 2021 Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, was recognized as a finalist in the East Bay Innovation Awards for its new LCS2 product. Out of more than 200 nominations, the Gel-Pak’s LCS2 product was among 20 innovations chosen for this […]Read More… from Gel-Pak named finalist in San Francisco East Bay’s innovation awards
Fixing the Bane of Costly Component Out Of Pocket Defects Posted on August 18, 2021 (September 6, 2023) The march of technological prog ress continues as traditionally bulky and discrete microwave devices become integrated in increasinglysmaller microelectronic modules and packages. New high performance GaN, GaAs, InP and other Class III-V and silicon semiconductor devices, along with high performance silicon variations such as SiC, are designed to push performance and enable new communications and […]Read More… from Fixing the Bane of Costly Component Out Of Pocket Defects
Mitigating the High Cost of Die Migration Posted on July 27, 2021 (September 6, 2023) By Darby Davis, Gel-Pak and Craig Blanchette, BAE Systems Expansion in the areas of SATCOM, automotive radar, 5G, and security are pushing high frequency semiconductor technologies toward smaller thinner footprints. These new high-performance Class III-V devices, made from materials such as GaN and GaAs, offer advanced features that enable a new generation of communication and […]Read More… from Mitigating the High Cost of Die Migration
Jeanne Beacham Featured in Concora Podcast Posted on June 3, 2021 (November 9, 2022) […]Read More… from Jeanne Beacham Featured in Concora Podcast
Gel-Pak showcases new products at international microwave symposium in Atlanta, GA Posted on June 3, 2021 (December 16, 2022) Hayward, CA June 3, 2021 Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, will showcase its new Lid Clip Super System LCS2™, Polyurethane Device Carrier, and Texturized Film Device Carrier at the International Microwave Symposium in Atlanta, GA June 8-10, 2021. Darby Davis, VP of Sales […]Read More… from Gel-Pak showcases new products at international microwave symposium in Atlanta, GA
Gel-Pak collaborates with BAE Systems on innovative packaging solution for thin semiconductor devices Posted on May 3, 2021 (December 16, 2022) Hayward, CA May 3, 2021 Gel-Pak, a division of Delphon and leading manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries announces its collaboration with BAE Systems on an innovative new product called the Lid/Clip Super System (LCS2™). The patent pending LCS2 product is designed to prevent thin semiconductor components […]Read More… from Gel-Pak collaborates with BAE Systems on innovative packaging solution for thin semiconductor devices
Gel-Pak Polyurethane VRP Series Vacuum Release Carrier Posted on April 13, 2021 (September 4, 2023) Gel-Pak’s new VRP product line consists of a proprietary cross-linked polyurethane film membrane over a mesh material that holds components in place until they are released “on-demand” by applying vacuum to the underside of the tray. The new polyurethane Vertec® vacuum release tray provides the same appearance and functionality as the traditional Gel VR Tray, […]Read More… from Gel-Pak Polyurethane VRP Series Vacuum Release Carrier
Gel-Pak’s New Polyurethane APV Series Gel-box Posted on April 13, 2021 (November 8, 2024) Gel-Pak’s APV product is a new line of pocketless device carriers that look and function the same as the standard Gel-Box AD series products, but with an alternative elastomer technology. APV boxes are manufactured using a proprietary static dissipative, non-silicone polyurethane elastomer instead of our traditional Gel. Securely holds devices in place during shipping, handling, […]Read More… from Gel-Pak’s New Polyurethane APV Series Gel-box
Gel-Pak’s Vertec® Texturized Film (GP-TXF) Posted on April 13, 2021 (November 8, 2024) Gel-Pak’s bioinspired texturized film carrier product is based on a proprietary TPE technology. The unique film mimics the adhesive forces of biometric structures found in nature, which securely hold components in place while allowing for easy removal. The film is ideal for in-process handling of bare die and leadless packaged components. Available in sheet and […]Read More… from Gel-Pak’s Vertec® Texturized Film (GP-TXF)
Many Chiplet Challenges Ahead Posted on April 12, 2021 (November 11, 2022) Assembling systems from physical IP is gaining mindshare, but there are technical, business and logistical issues that need to be resolved before this will work. Advanced packaging is seen as the most likely path to keep Moore’s Law going, but there are several challenges that have yet to be overcome — and several lurking pitfalls […]Read More… from Many Chiplet Challenges Ahead
Gel-Pak Partners With BAE Systems On Solution For Costly Component-Out-Of-Pocket Defects Posted on April 9, 2021 (November 22, 2024) Problem / Application Many of today’s leading semiconductor manufacturers experience issues with thin compound semi die (<250μm) migrating out of the pockets of waffle pack trays during shipping. BAE Systems, a large international defense electronics company, has documented the high cost of RMAs, yield loss and rework labor associated with this die migration issue. Based […]Read More… from Gel-Pak Partners With BAE Systems On Solution For Costly Component-Out-Of-Pocket Defects
Gel-Pak Designs Texturized-Film Device Carrier Platform Posted on April 9, 2021 (November 22, 2024) Problem / Application Semiconductor companies and industrial manufacturers alike need a universal carrier to safely to handle delicate devices of varying sizes within factories and hold components with precision alignment. Both a large OSAT company (Silicon Photonics Chip) and an industrial automation company (QFN Packages) reached out to Delphon’s Gel-Pak division to design universal carrier […]Read More… from Gel-Pak Designs Texturized-Film Device Carrier Platform
Jeanne Beacham Viewpoint 2021 Posted on January 14, 2021 (November 8, 2024) Delphon CEO, Jeanne Beacham shares her thoughts about semiconductor and microelectronic industry trends for 2021. VIEWPOINT 2021: Jeanne Beacham, CEO, Delphon Industries To say that our industry’s landscape experienced a profound shift in 2020 is an understatement. Companies found themselves plunged from the familiar rhythm of day-to-day business, with carefully thought-out roadmaps, to a sea […]Read More… from Jeanne Beacham Viewpoint 2021
Delphon appoints Joseph Montano as President Posted on January 6, 2021 (November 8, 2024) Hayward, CA, January 06, 2021 Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and aerospace industries, announced today the appointment of Joseph Montano as President. Reporting directly to CEO Jeanne Beacham, Joe will serve a critical role in the company’s leadership team as Delphon continues to grow through […]Read More… from Delphon appoints Joseph Montano as President
Gel-Pak Sponsors MEPTEC Known Good Die Virtual Workshop Posted on September 3, 2020 (December 16, 2022) Hayward, CA, September 3, 2020 Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor and optoelectronic devices, will sponsor MEPTEC’s Known Good Die Virtual Workshop held September 16-18th. The workshop is a cross-functional view of challenges and solutions for achieving known good die. Sponsorship from Gel-Pak, Muhlbauer, Amkor, Advantest, and ASE […]Read More… from Gel-Pak Sponsors MEPTEC Known Good Die Virtual Workshop
Gel-Pak for Fast Axis Collimator Lenses (FAC) Posted on August 3, 2020 (November 8, 2024) One of the most important optical components in the beam shaping systems of high power diode lasers is the Fast Axis Collimator (FAC) lens. FAC lenses are fragile and often have delicate coatings that can be easily scratched or damaged. Therefore, a key challenge in maintaining the integrity of this fragile optic is protecting its […]Read More… from Gel-Pak for Fast Axis Collimator Lenses (FAC)
Gel-Pak Exhibits at First Virtual Semicon West Exhibit Posted on July 20, 2020 (December 16, 2022) Hayward, CA, July 20, 2020 Gel-Pak, a division of Delphon and a world leader in protective semiconductor device handling solutions, will exhibit at the first VIRTUAL Semicon West Tradeshow. Due to concerns over the worldwide COVID-19 pandemic, Semi made the decision to hold their annual Semicon West Event virtually. The event is said to be […]Read More… from Gel-Pak Exhibits at First Virtual Semicon West Exhibit
Raj Varma, Delphon CTO, Delivers Technical Presentation on Bio-Inspired IC Carriers for MEPTEC Webinar Posted on April 15, 2020 (November 8, 2024) Hayward, CA, April 15, 2020 Delphon CTO Raj Varma delivered a technical presentation on bio-inspired carriers for a MEPTEC Semiconductor Industry Speaker Series Webinar. Continuing market demands for our gadgets to be both smaller and smarter is putting an exponential demand on Integrated Circuits (IC) in terms of reliability, size, thickness and cost. The ICs […]Read More… from Raj Varma, Delphon CTO, Delivers Technical Presentation on Bio-Inspired IC Carriers for MEPTEC Webinar
Gel-Pak presents new Lid/Clip Super System (LCS2™) at 24th Annual Components for Military and Space Electronics Conference Posted on April 15, 2020 (November 8, 2024) Hayward, CA April 15, 2020 Gel-Pak, a division of Delphon and leading manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries will present its new Lid/Clip Super System (LCS2™) at the upcoming Components for Military and Space Electronics Conference The patented LCS2™ was designed in partnership with BAE Systems to […]Read More… from Gel-Pak presents new Lid/Clip Super System (LCS2™) at 24th Annual Components for Military and Space Electronics Conference
Chip Industry Dodges Direct Impact of Coronavirus Posted on February 19, 2020 (September 6, 2023) By Barbara Jorgensen Source: EE Times The semiconductor industry appears to have escaped the direct impact of the coronavirus crisis so far, but the market is likely to suffer the repercussions as the outbreak slows or suspends production among electronics manufacturers, according to Omdia. Despite facing logistical, packaging and test challenges related to the Covid-19 outbreak, […]Read More… from Chip Industry Dodges Direct Impact of Coronavirus
Gel-Pak to Showcase Photonic device carrier products at photonics West 2020 in San Francisco. Posted on February 1, 2020 (November 8, 2024) Hayward, CA February 1, 2020 Gel-Pak, a division of Delphon and worldwide leader in protective carriers for optoelectronic devices, will be showcasing its innovative products at the SPIE Photonics West in San Francisco, California, February 4th-6th. Gel-Pak’s carriers protect sensitive optoelectronic devices such as lasers, micro-optics and filters during shipping, handling and processing. Gel-Pak’s unique […]Read More… from Gel-Pak to Showcase Photonic device carrier products at photonics West 2020 in San Francisco.
Gel-Pak® to Showcase its silicone film capabilities at MD&M West Posted on February 1, 2020 (November 8, 2024) Hayward, CA February 1, 2020 Gel-Pak®, a leader in device carrier and film products for the electronics and medical device industries will be showcasing its silicone film capabilities at the MD&M Show in Anaheim, CA February 11-13. Gel-Pak’s Gel-Film® and E-Film® product lines consists of highly engineered elastomer films that are ideal for medical applications. […]Read More… from Gel-Pak® to Showcase its silicone film capabilities at MD&M West
Customized Textured Carrier Posted on November 19, 2019 (November 22, 2024) Problem / Application A large, long-standing customer approached Gel-Pak to discuss the possibility of a customized textured device carrier. Challenges/Requirements The customer faced unique manufacturing process challenges and was having difficulty sourcing a solution that would help them improve efficiency. The customer needed the product to handle a broad range of devices sizes on the […]Read More… from Customized Textured Carrier
China Has Always Trailed the U.S. in Chipmaking. In the Trade War Era, Will It Finally Catch Up? Posted on November 15, 2019 (September 6, 2023) By Grady McGregor Source: Fortune, https://fortune.com/2019/11/15/us-china-trade-war-semiconductor-chips/ Can Tech Companies Bridge The Gap In The China-U.S. Trade War? Many tech companies are caught in the crossfire of the escalating trade and tech wars between China and the U.S. What are the fundamental issues that are dividing the two superpowers? China famously spends more on importing semiconductor […]Read More… from China Has Always Trailed the U.S. in Chipmaking. In the Trade War Era, Will It Finally Catch Up?
Gel-Pak to Showcase VTX – the next generation pocketless tray at Semicon West Posted on June 28, 2019 (November 8, 2024) Hayward, CA, June 28, 2019 Gel-Pak®, a division of Delphon and leading manufacturer of device carriers will showcase VTX – the next generation pocketless tray at the upcoming Semicon West Tradeshow in San Francisco, CA July 9-11. Gel-Pak’s 2” x 2” VTX Tray is part of a new family of lower cost device carriers based […]Read More… from Gel-Pak to Showcase VTX – the next generation pocketless tray at Semicon West
Gel-Pak To Showcases Carriers For GAAs And GaN Devices At IMS 2019 Posted on May 28, 2019 (November 8, 2024) Hayward, CA, May 28, 2019 Gel-Pak®, a division of Delphon and leading manufacturer of device carriers will showcase its innovative device carrier products designed to safely handle compound fragile GAAs and GaN semiconductor components at the IMS 2019 tradeshow in Boston, MA June 2-7. The move toward 5G has created a greater need for high-speed, […]Read More… from Gel-Pak To Showcases Carriers For GAAs And GaN Devices At IMS 2019
Delphon appoints Steven Chan as Corporate Chief Financial Officer Posted on April 15, 2019 (December 16, 2022) Hayward, CA, April 15, 2019 Delphon, a worldwide provider of engineered polymer and adhesive products for the electronics, medical and aerospace industries, announced today the appointment of Steven Chan as Chief Financial Officer. Mr. Chan is a seasoned executive with extensive experience in leading high-growth organizations in the life sciences and technology industries. Mr. Chan […]Read More… from Delphon appoints Steven Chan as Corporate Chief Financial Officer
Engineers: 5G, connected cars and AI will greatly impact semiconductors in the next 3 years Posted on April 10, 2019 (September 6, 2023) There are a number of new technologies on the horizon that will influence the semiconductor industry in the next three years. But according to a new survey of engineers by Advanced Energy, the biggest impact on the chip market will come from 5G, connected vehicles and implementing artificial intelligence (AI) into workflows. The survey, conducted […]Read More… from Engineers: 5G, connected cars and AI will greatly impact semiconductors in the next 3 years
Jeanne Beacham named one of Top 50 Most Powerful Women in Technology Posted on April 1, 2019 (January 8, 2025) Hayward, CA April 1, 2019 Delphon, a company that specializes in manufacturing polymer and adhesive solutions for the electronics, medical and aerospace industries, announced today that CEO Jeanne Beacham has been named one of the Top 50 Most Powerful Women in Technology. Every year, the National Diversity Council compiles a list of the Top 50 […]Read More… from Jeanne Beacham named one of Top 50 Most Powerful Women in Technology
Semiconductor Slowdown Scare Could Be Shortsighted Posted on January 17, 2019 (September 6, 2023) By Kevin Curran Jan 17, 2019 | 12:24 PM EST The long-term demand bolstered by secular shifts in technology is keeping many on board the ship for semiconductors in the long term. Taiwan Semiconductor’s (TSM) poor forecast to kick of 2019 threatened to sink semiconductor stocks lower on Thursday, but analysts and investors are still […]Read More… from Semiconductor Slowdown Scare Could Be Shortsighted
Delphon to Showcase its Device Carrier, Film, and Adhesive Products at MD&M West 2019 in Anaheim. Posted on January 8, 2019 (December 16, 2022) Hayward, CA January 08, 2019 Delphon an industry leader in polymer and adhesive products for the electronics and medical industries will be showcasing its medical device marking capabilities as well as its device carrier, film, tape and label products at the MD&M Show in Anaheim, CA February 5-7. Delphon offers a host of products and […]Read More… from Delphon to Showcase its Device Carrier, Film, and Adhesive Products at MD&M West 2019 in Anaheim.
Gel-Pak to Showcase Photonic Device Carrier Products at Photonics West 2019 in San Francisco. Posted on January 8, 2019 (December 16, 2022) Hayward, CA January 08, 2019 Gel-Pak will be showcasing its innovative device carrier products at the SPIE Photonics West in San Francisco, California, February 5-7. Gel-Pak’s carriers protect sensitive photonic devices such as lasers, micro-optics and filters during shipping, handling and processing. Gel-Pak’s unique ability to immobilize these fragile components ensures they will remain free […]Read More… from Gel-Pak to Showcase Photonic Device Carrier Products at Photonics West 2019 in San Francisco.
Gel-Pak Gel-Box for 5G Components Posted on November 9, 2018 (November 8, 2024) The move toward 5G has created a greater need for high-speed, high-efficiency compound semiconductors; these semiconductors tend to be brittle which means greater care needs be taken when handling them. Gel-Pak’s unique ability to immobilize these fragile components ensures they will remain free from damage during handling and transport. Our Gel-Box products come in a […]Read More… from Gel-Pak Gel-Box for 5G Components
Once Again, Delphon is One of the Best & Brightest Companies to Work for in The San Francisco Bay Area Posted on November 7, 2018 (December 16, 2022) Hayward, CA November 7, 2018 Delphon, a company that specializes in polymer and adhesive solutions for the electronics and medical industries, announced today that it has been named one of the San Francisco Bay Area’s Best and Brightest Companies to work for. Delphon was specifically recognized for creating a diverse, happy, and productive environment for […]Read More… from Once Again, Delphon is One of the Best & Brightest Companies to Work for in The San Francisco Bay Area
Delphon To Showcase Custom Polymer Films For Printed, Flexible And Hybrid Electronic At Printed Electronics 2018 Posted on November 7, 2018 (December 16, 2022) Hayward, CA November 07, 2018 Delphon is an innovative manufacturer of polymer and adhesive solutions to high-technology industries. The company will be showcasing its E-Film™ line at the Printed Electronics Show in Santa Clara, CA November 14-15. The rapid growth of the printed electronics industry over the last several years has demonstrated the growing significance […]Read More… from Delphon To Showcase Custom Polymer Films For Printed, Flexible And Hybrid Electronic At Printed Electronics 2018
Delphon Will Be Exhibiting At Biomedevice In San Jose, CA– DEC. 5-6, 2018 Posted on November 1, 2018 (December 16, 2022) Hayward, CA November 2018 Delphon is an innovative manufacturer of polymer and adhesive solutions for medical and electronic applications. The company will be showcasing its Gel-Pak®, E-Film™, UltraTape®, and TouchMark brands at the upcoming BIOMEDevice Tradeshow in San Jose, CA December 5-6. The E-Film product line consists of stretchable polymer films that are ideal for […]Read More… from Delphon Will Be Exhibiting At Biomedevice In San Jose, CA– DEC. 5-6, 2018
Product Spotlight: Gel-Pak® Gel-Box Carriers for Optical Filters Posted on July 26, 2018 (November 8, 2024) It can be a challenge for photonics suppliers to keep optical filters free from damage during shipping and handling. The fragile substrates that filters are made from lend themselves to cracks, scratches, and ultimately yield loss during transport. Gel-Pak’s Gel-Box® products provide the protection needed to ensure that fragile optical filters remain damage-free during shipping […]Read More… from Product Spotlight: Gel-Pak® Gel-Box Carriers for Optical Filters
Product Spotlight: Gel-Pak® VR Carriers for Thin Optical Filters Posted on July 26, 2018 (November 8, 2024) Safely shipping and handling today’s thin optical filters can be a challenge. Small part sizes and narrow substrate thickness can lead to breakage and yield loss during transport and offloading. Gel-Pak’s Vacuum Release TraysTM provide the ideal solution to ensure that fragile optical filters remain damage-free during transport. Filters packaged in a Vacuum Release TrayTM […]Read More… from Product Spotlight: Gel-Pak® VR Carriers for Thin Optical Filters
Gallium Nitride Enabling IoT Revolution, Cellular 5G, Optoelectronics, and Sensors Posted on July 8, 2018 (September 6, 2023) IDST July 8, 2018 GaN is a semiconductor material that can amplify high power radio frequency signals efficiently at microwave frequencies to enhance a system’s range. Therefore it has become the technology of choice for high-RF power applications that require the transmission of signals over long distances such as EW, radar, base stations and satellite […]Read More… from Gallium Nitride Enabling IoT Revolution, Cellular 5G, Optoelectronics, and Sensors
Gel-Pak Showcases Carriers For Compound Semiconductor Devices Posted on June 14, 2018 (November 8, 2024) Gel-Pak®, a division of Delphon and leading manufacturer of device carriers showcased its innovative products designed to safely handle compound semiconductors at the IMS 2018 tradeshow in Philadelphia, PA June 12-14. The move toward 5G has created a greater need for high-speed, high-efficiency compound semiconductors. Materials used to create these high power devices often include […]Read More… from Gel-Pak Showcases Carriers For Compound Semiconductor Devices
5G: What is it good for? Posted on June 5, 2018 (September 6, 2023) By Larry Downes 5G, or 5th generation mobile, is the next big leap in wireless communications. You’ve probably heard about it in commercials or seen it in headlines. But much of the discussion about the new technology has been focused on its engineering features, infrastructure requirements and public policy considerations. With technical buzzwords like “network […]Read More… from 5G: What is it good for?
Delphon Showcasing Custom Polymer Films, Gel-Pak Carriers, and Ultratape Products at Semicon 2018 Posted on June 1, 2018 (December 16, 2022) Hayward, CA June 1, 2018 Delphon an industry leader in polymer and adhesive products for the electronics and medical industries, will be showcasing its custom films, Gel-Pak device carriers and UltraTape cleanroom tape and label products at the upcoming Semicon West Show in San Francisco, CA. Delphon’s newly introduced E-Film™ is a line of polymer […]Read More… from Delphon Showcasing Custom Polymer Films, Gel-Pak Carriers, and Ultratape Products at Semicon 2018
Product Spotlight: Optical Transceivers Posted on May 21, 2018 (November 8, 2024) Gel-Pak® offers carriers that protect optical transceiver components during manufacturing processes and shipping: Beam splitters Diffraction Gratings Fiber Tips Glass Capillaries Laser Diode/Bar (LD) Micro-Optics Optical Transceivers Photodiodes (PD) CMOS and CCD Sensors Electro-Absorption Modulator (EAM) Focal Plane Arrays Glass Wafers Lithium Niobate Modulators Optical Filter Optical Waveguides Customers rely on Gel-Pak® to protect and […]Read More… from Product Spotlight: Optical Transceivers
Gel-Pak Showcases Carriers For Compound Semiconductor Devices Posted on May 1, 2018 (December 16, 2022) Hayward, CA, May 1, 2018 Gel-Pak®, a division of Delphon and leading manufacturer of device carriers, designed a custom Vacuum Release Tray TM (VR Tray) to ship fragile Planar Lightwave Circuits (PLC). One of the world’s largest photonic component manufacturers needed to safely ship and handle large volumes of highly polished Planar Lightwave Circuit devices. […]Read More… from Gel-Pak Showcases Carriers For Compound Semiconductor Devices
Delphon Showcasing E-Film™ and Gel-Pak Products For New Generation Of Flexible Hybrid Electronics Posted on April 20, 2018 (November 8, 2024) Hayward, CA April 20, 2018 Delphon an industry leader in polymer and adhesive products for the electronics and medical industries, will be showcasing its E-Film™ and Gel-Pak® device carriers at a special one day event on Flexible Hybrid Electronics presented by MEPTEC at the NEXTFLEX headquarters in Santa Clara, CA. Delphon’s newly introduced E-Film™ is […]Read More… from Delphon Showcasing E-Film™ and Gel-Pak Products For New Generation Of Flexible Hybrid Electronics
Product Spotlight: Gel-Tray® (BD Trays) Posted on April 12, 2018 (November 8, 2024) Gel-Pak® BD Trays are ideal for shipping, handling and assembling optical components such as prisms, lenses and micro-lenses. This product offers the same functionality as the 2″ x 2″ Gel-Box, however the Gel coated plastic tray can be easily removed from the hinged box. This offers a convenient solution for customers who prefer to place […]Read More… from Product Spotlight: Gel-Tray® (BD Trays)
Product Spotlight: Special Waffle Pack Lid for Thin Die Handling Posted on April 12, 2018 (November 8, 2024) Prevent your fragile, thin die from migrating between pockets during shipping and handling with Gel-Pak’s specially designed Waffle Pack Lid. Shipping thin die in waffle packs presents a challenge for many companies. Thin devices packed in these chip trays have a tendency to move around within their pockets and can “escape” from their pockets during […]Read More… from Product Spotlight: Special Waffle Pack Lid for Thin Die Handling
Application Spotlight: Gel-Pak® Gel-Tray Product For Shipping Fragile GaAs Chips used in New Smartphone Posted on April 12, 2018 (November 8, 2024) One of the Asia’s premier GaAs foundries, offering high speed GaAs MMIC’s (monolithic microwave ICs) and RFIC’s (radio frequency ICs) had been working to get their PA (power amplifier) chips qualified by a leading US semiconductor manufacturer for use in a new smartphone. The GaAs foundry was required to make several large shipments of KGD […]Read More… from Application Spotlight: Gel-Pak® Gel-Tray Product For Shipping Fragile GaAs Chips used in New Smartphone
Product Spotlight: Carriers for Photonic Devices Posted on April 12, 2018 (November 8, 2024) Gel-Pak® offers carriers that protect sensitive photonic devices during shipping, handling, and processing. Customers use Gel-Pak® to handle components such as: Beam splitters Diffraction Gratings Fiber Tips Glass Capillaries Laser Diode/Bar (LD) Micro-Optics Optical Transceivers Photodiodes (PD) CMOS and CCD Sensors Electro-Absorption Modulator (EAM) Focal Plane Arrays Glass Wafers Lithium Niobate Modulators Optical Filter Optical […]Read More… from Product Spotlight: Carriers for Photonic Devices
Product Spotlight: DGL Film for Crystal Vacuum Coating Posted on April 12, 2018 (November 8, 2024) Gel-Pak DGL Film Securely Holds Fragile Optics in Place During Vacuum Coating Process The Gel-Pak DGL film product is highly cross-linked polymer material designed for use in high temperature vacuum coating applications. The DGL film has a tacky surface which holds fragile glass/crystals/optics in place during the coating process. The DGL film is used one-time […]Read More… from Product Spotlight: DGL Film for Crystal Vacuum Coating
Product Spotlight: Universal Fixturing Solution (Gel-Film) for QC Inspection of Devices Posted on April 12, 2018 (November 8, 2024) Improve efficiency and reduce QC inspection costs by using Gel-Film. Gel-Pak’s WF-A film product functions as a universal fixture which is ideal for holding devices in place during device QC inspection, processing or assembly. Provides low stiction force to temporarily hold devices in place Ideal for rapid prototype fixtures Low cost compared to mechanical tooling […]Read More… from Product Spotlight: Universal Fixturing Solution (Gel-Film) for QC Inspection of Devices
Product Spotlight: H-Mesh Gel-Pak VR Tray Posted on April 12, 2018 (November 8, 2024) H-Mesh Gel-Pak VR Tray For over 30 years, Gel-Pak has been at the forefront of developing unique carrier products that meet the needs of high technology industries. The H-Mesh Vacuum Release Tray, for example, is a product ideally suited for shipping and handling fragile high aspect ratio devices such as laser bars, modulators, and optical […]Read More… from Product Spotlight: H-Mesh Gel-Pak VR Tray
Product Spotlight: Print Options Posted on April 12, 2018 (November 8, 2024) Print Options: Gel-Pak customers can customize its Gel-carrier products with a print pattern or a company logo. Use one of Gel-Pak’s standard print grids found at here or customize your own to meet the needs of your particular application. Gel-Pak products can be imprinted with a print pattern or grid to assist with both placement […]Read More… from Product Spotlight: Print Options
Product Spotlight: Gel-Slide (CD Series) Posted on April 12, 2018 (November 8, 2024) Gel-Pak’s Gel-Slide (CD Series) is Ideal for High Temperature or Backside Inspection Applications. To effectively hold your device in place during reflow, bonding, coating, or other high temperature operations, Gel-Pak’s CD carrier is the ideal solution. Its optical clarity also allows for backside inspection. The CD Product consists of a 2″ x 22 Gel-coated glass […]Read More… from Product Spotlight: Gel-Slide (CD Series)
Product Spotlight: Membrane Boxes for Test Sockets Posted on April 12, 2018 (November 8, 2024) Membrane Boxes are ideal for shipping Test Sockets Gel-Pak’s Membrane Boxes are an ideal solution for storing and shipping three dimensional objects like test sockets, lenses, and optics. They are constructed using a thin, highly elastic, transparent membrane mounted to the top and bottom halves of a clear polystyrene box. When the box is closed, […]Read More… from Product Spotlight: Membrane Boxes for Test Sockets
Product Spotlight: Customize your Gel-Pak Carrier with a Print Pattern or Company Logo Posted on April 12, 2018 (November 8, 2024) Whether you want a grid to assist with placement and inventory tracking, a company logo, or a product name – Gel-Pak has a solution for you. Gel-Pak offers an entire catalog of print options for its Gel-Box, Tray, Slide, and Vacuum Release products. Use one of our standard print grids to help organize your components, […]Read More… from Product Spotlight: Customize your Gel-Pak Carrier with a Print Pattern or Company Logo
Product Spotlight: ESD Membrane Box Posted on April 12, 2018 (November 8, 2024) Small scale electronic components and semiconductor devices can be susceptible to damage due to Electrostatic Discharge (ESD). One of the ways electronics manufacturers can reduce the risk of IC failures due to ESD is by using a static dissipative carrier for shipping and storage. Ideal for 3-dimensional objects Gel-Pak’s ESD Membrane Box is an ideal […]Read More… from Product Spotlight: ESD Membrane Box
Product Spotlight: Gel-Pak Offers Biocompatible Carriers Posted on April 12, 2018 (November 8, 2024) The medical device industry faces stringent FDA standards for manufacturing and handling medical components. Gel-Pak recognizes this and manufactures its line of gel-coated boxes, trays, slides and films to meet biocompatibility requirements. The company’s biocompatible elastomer securely holds medical devices in place during shipping, handling, and processing. All Gel-Pak products are manufactured in an ISO […]Read More… from Product Spotlight: Gel-Pak Offers Biocompatible Carriers
Product Spotlight: Gel-Pak Carriers Protect Optical Lenses During Shipping, Handling, and Storage Posted on April 12, 2018 (November 8, 2024) Gel-Pak’s gel-coated boxes, trays, slides, and films are an ideal solution for safely transporting, handling, and storing Optical Lenses. Our unique Gel technology immobilizes your device to ensure it remains damage free. Gel-Pak offers a wide range of sizes and configurations and the product can be customized with a grid or logo to meet the […]Read More… from Product Spotlight: Gel-Pak Carriers Protect Optical Lenses During Shipping, Handling, and Storage
Product Spotlight: Versatile Gel-Coated Film for Kitting and Fixturing Posted on April 12, 2018 (November 8, 2024) Improve manufacturing efficiency and reduce fixturing costs with Gel-Pak’s Gel-Film. Gel-Pak offers a versatile Gel-coated film that is ideal for holding small parts in place during processing or assembly. The WF version has the option for a pressure sensitive adhesive backing which enables mounting the film to any flat working surface. The PF or DGL […]Read More… from Product Spotlight: Versatile Gel-Coated Film for Kitting and Fixturing
Product Spotlight: Gel-Pak increases throughput in automated inspection and measurement processes Posted on April 12, 2018 (November 8, 2024) Automated inspection and measurement systems allow medical device manufacturers to verify dimensions as well as qualify parts and processes. Working with small components can be a challenge, as it is sometimes difficult to maintain orientation and position as parts move through the inspection system. Gel-Pak’s optically clear gel material helps improve efficiency by effectively holding […]Read More… from Product Spotlight: Gel-Pak increases throughput in automated inspection and measurement processes
Product Spotlight: Gel-Pak Carriers for ESD Sensitive Devices Posted on April 12, 2018 (November 8, 2024) Gel-Pak offers a variety of device carriers for applications where electrostatic discharge is a concern. These carriers securely hold components in place during shipping, handling, and processing. TGel-Pak ESD AD Carriers: These versatile pocketless carriers are ideal for storing and transporting fragile devices that must avoid exposure to electrostatic discharge. Comprised of a conductive or […]Read More… from Product Spotlight: Gel-Pak Carriers for ESD Sensitive Devices
Congratulations To Jeanne Beacham, CEO Of Delphon Industries For Beign Awarded The Manufacturing Institutes Step Ahead Award, Her Advocacy, Mentorship, Achievements And Leadership Have Not Gone Unoticed Posted on April 10, 2018 (November 8, 2024) Hayward, CA April 10, 2018 The Manufacturing Institute announced they will award Jeanne Beacham with the Women in Manufacturing STEP (Science, Technology, Engineering and Production) Ahead Award. The STEP Ahead Awards honor women who have demonstrated excellence and leadership in their careers and represent all levels of the manufacturing industry, from the factory-floor to the […]Read More… from Congratulations To Jeanne Beacham, CEO Of Delphon Industries For Beign Awarded The Manufacturing Institutes Step Ahead Award, Her Advocacy, Mentorship, Achievements And Leadership Have Not Gone Unoticed
PDMS films for printed electronics – Methods and Advancements. Posted on March 1, 2018 (December 20, 2022) Dr. Victoria Tran, Delphon R&D Director delivered a talk about PDMS films at the recent FLEX Conference. Polydimethysiloxane (PDMS) is an attractive material for printed electronics. It is a soft, water impermeable dielectric and a familiar material for encapsulating and protecting electronics. In addition, PDMS is an ideal material for medical applications given its biocompatibility, […]Read More… from PDMS films for printed electronics – Methods and Advancements.
Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.5 Percent in 2018 Posted on February 12, 2018 (November 10, 2022) Worldwide semiconductor revenue is forecast to total $451 billion in 2018, an increase of 7.5 percent from $419 billion in 2017, according to Gartner, Inc. This represents a near doubling of Gartner’s previous estimate of 4 percent growth for 2018. “Favorable market conditions for memory sectors that gained momentum in the second half of 2016 […]Read More… from Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.5 Percent in 2018
Delphon To Showcase Custom Polymer Films For Flexible Hybrid Electronics At Flex 2018 Posted on February 11, 2018 (December 16, 2022) Hayward, CA February 11, 2018 Delphon an industry leader in polymer and adhesive products for the electronics and medical industries, will be showcasing its custom E-Film at the upcoming FLEX 2018 show, Feb 12-18 in Monterey, CA. The company™ R&D Director, Victoria Tran will also be speaking about silicone films for Flexible Hybrid Electronics. Developments […]Read More… from Delphon To Showcase Custom Polymer Films For Flexible Hybrid Electronics At Flex 2018
Flexible, Stretchable Photonic Devices Developed Posted on February 7, 2018 (September 6, 2023) A new material produced by Juejun Hu and his team can be repeatedly stretched without losing its optical properties. Image: Courtesy of the researchers. Researchers at MIT and several other institutions have developed a method for making photonic devices – similar to electronic devices but based on light rather than electricity – that can bend […]Read More… from Flexible, Stretchable Photonic Devices Developed
Delphon Showcasing E-Film™ At MD&M West Posted on February 5, 2018 (November 8, 2024) Hayward, CA February 05, 2018 Delphon an industry leader in polymer and adhesive products for the electronics and medical industries, will be showcasing its E-Film™ at the MD&M Show in Anaheim, CA February 6-8. Developments in wearable medical devices, electronic performance garments, and flexible electronics have created an industry need for stretchable film substrates. Delphon’s […]Read More… from Delphon Showcasing E-Film™ At MD&M West
Gel-Pak Showcases Photonic Device Carrier Products At Photonics West Tradeshow In San Francisco Posted on January 30, 2018 (December 16, 2022) Hayward, CA January 30, 2018 Gel-Pak®, a division of Delphon and leading manufacturer of device carrier products showcased its innovative device carrier products and the Photonics West Tradeshow in San Francisco Jan 27 – Feb 1. Gel-Pak’s device carriers hold fragile photonic components in place during shipping, handling and processing. The Photonics West Tradeshow was […]Read More… from Gel-Pak Showcases Photonic Device Carrier Products At Photonics West Tradeshow In San Francisco
Delphon Announces PWP Growth Equity Investment Posted on January 11, 2018 (November 8, 2024) Hayward, CA January 11, 2018 Delphon Industries (“Delphon” or “the Company”), a sophisticated manufacturer of device protection and adhesive products, announced that it has received an equity investment from PWP Growth Equity. PWP Growth Equity is the middle market private equity group of Perella Weinberg Partners, investing in leading, growth-oriented, lower middle market companies. Terms […]Read More… from Delphon Announces PWP Growth Equity Investment
Delphon Was Named One Of The Best And Brightest Places To Work In The Bay Area For The Third Year In a Row Posted on October 17, 2017 (December 16, 2022) Hayward, CA, October 17, 2019 Delphon, a company that specializes in poly>mer and adhesive materials for the electronics and medical industries, announced today that it has once again been named one of the San Francisco Bay Area’s Best and Brightest Companies to work for. This is the third year in a row that Delphon has […]Read More… from Delphon Was Named One Of The Best And Brightest Places To Work In The Bay Area For The Third Year In a Row
Jeanne Beacham Nominated For The Manufacturing Institute’s Step Ahead Award Posted on October 11, 2017 (December 16, 2022) Hayward, CA October 11, 2017 Contact: Jennifer Dossee Nunes Phone: 510-576-2253 Delphon, a company that specializes in manufacturing polymer and adhesive solutions for the electronics and medical industries, announced today that CEO Jeanne Beacham has been nominated for The Manufacturing Institutes STEP Ahead Award. The STEP Ahead Award identifies and highlights women who have contributed […]Read More… from Jeanne Beacham Nominated For The Manufacturing Institute’s Step Ahead Award
Delphon Named One Of San Francisco Bay Area’s Best And Brightest Companies To Work For Posted on September 18, 2017 (November 8, 2024) Hayward, CA September 18, 2017 Contact: Jennifer Dossee Nunes Phone: 510-576-2253 Delphon, a company that specializes in polymer and adhesive solutions for the electronics and medical industries, announced today that it has been named one of the San Francisco Bay Area’s Best and Brightest Companies to work for. The Best and Brightest Companies to Work […]Read More… from Delphon Named One Of San Francisco Bay Area’s Best And Brightest Companies To Work For
Jeanne Beacham Awarded The Excellence In Mentorship Of Early Scientists Award Posted on August 26, 2017 (December 16, 2022) Hayward, CA August 26, 2017 Contact: Jennifer Dossee Nunes Phone: 510-576-2253 Delphon, a company that specializes in polymer and adhesive solutions for the electronics and medical industries, announced today that CEO Jeanne Beacham has been honored with the Excellence in Mentorship of Early Career Scientists Award by the University of Oregon’s Master’s Industrial Internship Program. […]Read More… from Jeanne Beacham Awarded The Excellence In Mentorship Of Early Scientists Award
Asia-Pacific, Eyes Photonics Market Growth Posted on August 8, 2017 (September 6, 2023) By Justine Murphy, Senior Editor. The ongoing development of manufacturing and telecommunications technologies, among others, is thrusting the industry to the top of the global goods market. Asia-Pacific, in particular, is expected to grow quickly and steadily. The global photonics market will continue its fervent growth in the coming years, according to a number of […]Read More… from Asia-Pacific, Eyes Photonics Market Growth
Semiconductor Sales Tracking up 21% From 2016 Posted on August 4, 2017 (September 6, 2023) By Dylan McGrath SAN FRANCISCO — Semiconductor sales are up nearly 21 percent year-to-date, punctuated by the highest ever sales total in the second quarter, according to the Semiconductor Industry Association (SIA). Chip sales for the second quarter totaled a record $97.9 billion, up 6 percent from the previous quarter and up 24 percent compared […]Read More… from Semiconductor Sales Tracking up 21% From 2016
Delphon Showcasing Custom Polymer Films, Gel-Pak Carriers, And Ultratape Products At SEMICON 2017 – BOOTH 6057 Posted on July 7, 2017 (December 16, 2022) Hayward, CA July 7, 2017 Contact: Jennifer Dossee Nunes Phone: 510-576-2253 Delphon an industry leader in polymer and adhesive products for the electronics and medical industries, will be showcasing its custom films, Gel-Pak device carriers and UltraTape cleanroom tape and label products at the upcoming Semicon West Show in San Francisco, CA. Delphon’s in-house R […]Read More… from Delphon Showcasing Custom Polymer Films, Gel-Pak Carriers, And Ultratape Products At SEMICON 2017 – BOOTH 6057
Delphon Showcasing Custom Polymer Films For Flexible Hybrid Electronics At Flex 2017 Posted on June 12, 2017 (December 16, 2022) Hayward, CA June 12, 2017 Delphon an industry leader in polymer and adhesive film products for the electronics and medical industries, will be showcasing its custom films for Flexible Hybrid Electronics (FHE) at the upcoming FLEX 2017 show June 19-22 in Monterey, CA. Delphon’s in-house R&D team along with a number of industry-leading electronics and […]Read More… from Delphon Showcasing Custom Polymer Films For Flexible Hybrid Electronics At Flex 2017
Gel-Pak Expands Position In Growing Photonics Market During First Quarter Posted on April 14, 2017 (November 8, 2024) Hayward, CA, April 14, 2017 Gel-Pak Provides Innovative Device Carrier Products to the Semiconductor, Photonics, and Medical Device Markets. Gel-Pak®, a division of Delphon and leading manufacturer of device carrier products announces a >20 % growth in sales to customers in the photonics industry during the first quarter of 2017. Gel-Pak’s device carriers protect fragile […]Read More… from Gel-Pak Expands Position In Growing Photonics Market During First Quarter
Developing and Evaluating a Flexible Wireless Microcoil Array Based Integrated Interface for Epidural Cortical Stimulation Posted on March 29, 2017 (September 6, 2023) Xing Wang 1, Sharjeel A. Chaudhry 2, Wensheng Hou 1 and Xiaofeng Jia 3,4,5,6,7,* Key Laboratory of Biorheological Science and Technology, Ministry of Education, College of Bioengineering, Chongqing University, Chongqing 400044, China; wangxing@cqu.edu.cn (X.W.); w.s.hou@cqu.edu.cn (W.H.) School of Medicine and Health Sciences, George Washington University, Washington, DC 20037, USA; sharjeel@gwu.edu Department of Neurosurgery, University of […]Read More… from Developing and Evaluating a Flexible Wireless Microcoil Array Based Integrated Interface for Epidural Cortical Stimulation
Annual Laser Market Review & Forecast: Where have all the lasers gone? Posted on January 23, 2017 (September 6, 2023) Laser companies both small and large are feeling the recent surge of techsector M&A activity. Whether a timetomarket or portfolio expansion play, the details reveal much about where the laser industry is headed in the next decade—notwithstanding surprises related to Brexit or U.S. elections. GAIL OVERTON, ALLEN NOGEE, DAVID BELFORTE, and CONARD HOLTON Once considered […]Read More… from Annual Laser Market Review & Forecast: Where have all the lasers gone?
A sticky TEST but helpful situation for fragile medical devices Posted on January 20, 2017 (September 6, 2023) By Daphne Allen in Medical Packaging Components being loaded on Gel-Pak via pick & place equipment One stop on our Packaging Innovation Tour at MD&M Minneapolis 2016 was GelPak, a company offering a biocompatible gel that can be coated onto the bottom of boxes, trays, slides, and films to secure medical components in place during […]Read More… from A sticky TEST but helpful situation for fragile medical devices
Delphon Reports Record Sales For 2016 Posted on January 12, 2017 (December 16, 2022) Hayward, CA, January 12, 2017 Delphon, a company that specializes in polymer and adhesive solutions for the electronics and medical industries, reported record sales for the year ending December 31, 2016. The company reported sales were up 16% over 2015 figures, a gain equally spread between both domestic and international transactions. The increase was driven […]Read More… from Delphon Reports Record Sales For 2016
Global Photonics Market Set for Growth Posted on November 10, 2016 (December 20, 2022) Photonics.com The global photonics market is set to reach $766 billion by 2020, according to a new report from Transparency Market Research. Expanding from 2013’s figure of $510 billion with a compound annual growth rate of 5.8 percent, the market’s growth is being driven by the demand for highly capable and efficient electronic products, as […]Read More… from Global Photonics Market Set for Growth
Wearables: The Next Big Technology Trend? Posted on September 13, 2016 (December 20, 2022) By: Prableen Bajpai Referenced Stocks: AAPL;FIT;GOOG;GOOGL;SNE;GRMN With the technology seeping deeper and deeper into our daily lives, the future of smart “wearables” looks bright. Wearables is a common term for devices or technology with features like scanners and sensors, and are, obviously, worn by a person. They come in different, such as clothes, spectacles, accessories, […]Read More… from Wearables: The Next Big Technology Trend?
Gel-Pak WF Film Used to Retrieve Bioparticles for Ultrasensitive Forensic DNA Profiling: Posted on June 13, 2016 (November 11, 2022) In forensics, it is sometimes necessary to retrieve genetic profiles from the microscopic amounts of biological material left behind in a crime. The “touch DNA” evidence that results from shed skin cells transferred from a person to an object or another person is typically recovered by using a cotton swab. However, there are limitations in […]Read More… from Gel-Pak WF Film Used to Retrieve Bioparticles for Ultrasensitive Forensic DNA Profiling:
Delphon CEO Jeanne Beacham Accepted To The Committee Of 200 Posted on May 5, 2016 (December 16, 2022) Hayward, CA, May 5, 2016 Jeanne Beacham, CEO of Delphon, a company that specializes in polymer and adhesive solutions for the medical and electronics industries, was recently accepted to The Committee of 200 (C200), an organization of leading women business owners and corporate executives. C200 is an invitation-only, global organization composed of the world’s most […]Read More… from Delphon CEO Jeanne Beacham Accepted To The Committee Of 200
Global Photonic Integrated Circuit (PIC) Industry Posted on March 11, 2016 (November 8, 2024) Source: (http://www.prnewswire.com/) From Reportlinker (http://www.prnewswire.com/news/reportlinker) NEW YORK, March 1, 2016 /PRNewswire/ — This report analyzes the worldwide markets for Photonic Integrated Circuit (PIC) in US$ Thousand. The Global market is further analyzed by the following Applications and Integration Methods: By Application – Optical Signal Processing, Optical Communications, and Others; By Integration Methods – Packaging, and […]Read More… from Global Photonic Integrated Circuit (PIC) Industry
The Dreaded “Antistatic Zone” Posted on February 18, 2016 (November 10, 2022) A Summary of Material Resistivity Classification Triboelectric Charge Generation is caused by the separation of materials. Charge generation can be caused by separating similar materials (film coming off a reel or tape off a roll) and dissimilar materials (lifting a package off a workbench). Prior to 1981, static control material was classified as to its […]Read More… from The Dreaded “Antistatic Zone”
Gel-Pak Sister Company, Ultratape, Acquires High Tech Graphics (HTG) Posted on February 2, 2016 (December 16, 2022) Wilsonville, OR February 2, 2016 UltraTape Industries, a division of Delphon and leading manufacturer of cleanroom tape, labels and custom adhesive material products, announced today that it has completed its acquisition of High Tech Graphics (HTG) of Sherwood, OR. HTG manufactures custom graphic overlays and provides material coating services to a wide range of industrial […]Read More… from Gel-Pak Sister Company, Ultratape, Acquires High Tech Graphics (HTG)
The Semiconductor Industry’s Demographic Changes in 2016 Posted on December 24, 2015 (September 6, 2023) Changing demographic In the previous part of the series, we saw that the semiconductor industry entered into a phase of slow growth that sparked consolidation. In 2016, the demand is expected to revive in the Americas but slacken in the Asia-Pacific region. This is changing the demographics of the semiconductor industry. SEMI® 2015 Year-e nd […]Read More… from The Semiconductor Industry’s Demographic Changes in 2016
Deterministic transfer of two-dimensional materials by all-dry viscoelastic stamping Posted on November 17, 2015 (November 8, 2024) Andres Castellanos-Gomez *, Michele Buscema, Rianda Molenaar, Vibhor Singh, Laurens Janssen,Herre S. J. van der Zant and Gary A. Steele Kavli Institute of Nanoscience, Delft University of Technology, Lorentzweg 1, 2628 CJ Delft (The Netherlands). a.castellanosgomez@tudelft.nl ABSTRACT Deterministic transfer of two-dimensional crystals constitutes a crucial step towards the fabrication of heterostructures based on artificial stacking […]Read More… from Deterministic transfer of two-dimensional materials by all-dry viscoelastic stamping
Tips for Handling and Storing GaAs and MMIC Devices Posted on October 30, 2015 (November 11, 2022) Gel-Pak VR Trays are often the standard handling and storage method for GaAs and MMIC devices. The VR Products are membrane based trays that hold die in place during shipping and handling. They release components only when required. The surface contact between the die and the gel membrane on the tray surface has two independent […]Read More… from Tips for Handling and Storing GaAs and MMIC Devices
Semi-Automated Micro Assembly for Rapid Prototyping of a One DOF Surgical Wrist Posted on September 30, 2015 (September 6, 2023) Ranjana Sahai, Jusuk Lee, and Ronald S. Fearing{rsahai, ronf}@eecs.berkeley.eduDepartment of EECS, University of California, Berkeley, CA 94720. USA Abstract We have developed new methods for the automated assem- bly of prototype structures and we illustrate them with the construction of a simple one DOF 5mm surgical wrist em- ploying polyester flexures instead of revolute joints. […]Read More… from Semi-Automated Micro Assembly for Rapid Prototyping of a One DOF Surgical Wrist
Understanding ESD And EOS Failures In Semiconductor Devices Posted on July 30, 2015 (September 6, 2023) Static electricity can be defined as a stationary charge that builds up on the surface of a material. The interaction between stationary charges, known as electrostatics, leads to two key problems: electrostatic overstress (EOS) and electrostatic discharge (ESD). ESD Background Typically, ESD causes more than one-third of the field failures in the semiconductor industry. ESD-induced […]Read More… from Understanding ESD And EOS Failures In Semiconductor Devices
Global Semiconductor Market Outlook 2020 Posted on May 5, 2015 (December 20, 2022) NEW YORK, /PRNewswire/ The global semiconductor market has been experiencing a stimulating growth in recent times despite the industry suffering from a decline in revenue due to the economic downturn in 2010. Advancement in technology, emergences of mobile devices and consumer electronics, and new application areas are further expected to lead the global semiconductor market […]Read More… from Global Semiconductor Market Outlook 2020
Gel-Pak Helps Increase Yield For Thin Wafers Posted on March 13, 2015 (December 16, 2022) Thermal Slide debonding for temporary bonding processes Thermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage originate during upstream bonding material coating, curing, bonding, and thinning processes. Moreover, only thermal separation tools that are […]Read More… from Gel-Pak Helps Increase Yield For Thin Wafers
Camera-guided Feeding of Optics in Robotbased Laser Assembly Posted on March 4, 2015 (September 7, 2023) Daniel Zontar1, Sebastian Haag1* and Christian Brecher2 Fraunhofer Institute for Production Technology IPT, Steinbachstr. 17, 52074 Aachen, Germany Head of the department of Production Machines at Fraunhofer Institute for Production Technology IPT and Chair at the Laboratory for Machine Tools and Production Engineering (WZL) at RWTH Aachen University, Steinbachstr. 19, 52074 Aachen, Germany * Corresponding […]Read More… from Camera-guided Feeding of Optics in Robotbased Laser Assembly
Cree 50V GaN HEMT die are supplied in Gel-Pak Vacuum Release Trays Posted on February 17, 2015 (January 13, 2025) Cree, Inc., a leading global supplier of silicon carbide (SiC) and gallium nitride (GaN) wafers and devices, has extended its family of 50V discrete GaN high electron mobility transistor (HEMT) die with the release of three new components: a 20W, 6GHz die; a 75W, 6GHz die; and a 320W, 4GHz die. Currently comprised of five […]Read More… from Cree 50V GaN HEMT die are supplied in Gel-Pak Vacuum Release Trays