Eliminate Costly Component Out Of Pocket Defect Condition Posted on October 10, 2021 (December 16, 2022) by JastMedia ☰ Quick Links × Quick Links E-Store Request Quote Request Sample Contact Technical Support Product Selection Wizard Calculate Number Of Devices/Carrier Gel-Pak Brochure Hayward, CA October 10, 2021 AT IMAPS INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor and optoelectronic devices and BAE Systems, a global military electronics manufacturer, will present a paper titled Eliminating Costly Component Out of Pocket Defect Condition During Semiconductor IC Transport/Handing at the IMAPS International Symposium on Microelectronics in San Diego, CA October 12-14. The paper presented by Craig Blanchette, BAE Systems Senior Principal Process Engineer, and Darby Davis, Gel-Pak Vice President of Sales and Marketing, will discuss issues associated with thin die migration out of the pockets of waffle pack chip trays during shipping and handling. The paper highlights the root causes of die migration and quantifies its cost. A new lid/clip system called LCS2™, developed in collaboration between BAE systems and Gel-Pak will be presented as a solution to the costly die migration issue. The patent pending LCS2 features a static dissipative padded lid and one-piece clip that together effectively seal semiconductor chips within their pockets and prevent die migration. Founded in 1980, Gel-Pak has developed a line of proprietary elastomer based device carriers and handling materials that offer solutions for applications where damage during handling must be avoided. The company’s unique elastomer technology serves as the basis of its Gel-Box™, Gel-Tray®, Gel-Slide®, E-Film™ and patented Vacuum Release™ products. These products effectively immobilize devices during shipping and handling. For further information on Gel-Pak’s product line, please refer to the website at www.gelpak.com. About Delphon Delphon is the materials incubator and advanced manufacturing center known for solving unique product development and manufacturing challenges. By combining unique materials and proprietary technologies in its state-of-the-art clean-room facilities, Delphon partners with customers to move ideas into novel products. Its well-known brands Gel-Pak, UltraTape and TouchMark are innovators of solutions for diverse markets including semiconductors, data storage, advanced medical devices, optical, photonics, aerospace, and defense. For more information, please contact Jennifer Nunes, Sr. Director of Marketing, at jnunes@delphon.com or visit www.delphon.com Gel-Pak's experienced technical support staff is available to answer your questions related to products or associated applications. Contact Us!