Shipping and Handling of Planar Lightwave Circuits (PLC) Posted on October 12, 2022 (November 22, 2024) by JastMedia By the definition, the fragile and highly polished Planar Lightwave Circuits (PLC) are difficult to operate with without any damages or scratches. Gel-Pak VR tray technology faced the challenge and was able not just outperformed the most common for industry Waffle Packs, but provided to the total exclusion of the possibility of damages during the […]Read More… from Shipping and Handling of Planar Lightwave Circuits (PLC)
Shipping GaAs for Power Amplifier Posted on October 12, 2022 (November 22, 2024) by JastMedia Application: One of the Asia’s premier GaAs foundries, offering high speed GaAs MMIC’s (monolithic microwave ICs) and RFIC’s (radio frequency ICs) had been working to get their PA (power amplifier) chips qualified by a leading US semiconductor manufacturer for use in Apple’s iPhone products. The GaAs foundry was required to make several large shipments of […]Read More… from Shipping GaAs for Power Amplifier
Optical Sub-Assembly Handling During Manufacturing Posted on October 12, 2022 (November 22, 2024) by JastMedia Application: The world’s largest supplier of optical communication products required a special carrier for their small Optical Sub-Assembly (OSA) manufacturing process. Their OSA device, which is comprised of many small, fragile passive and active components, is a high-end product that enables 100GHz infrastructure. The company reached out to Gel-Pak in search of a device carrier […]Read More… from Optical Sub-Assembly Handling During Manufacturing
Shipping and Handling Multi-binned IC’s Posted on October 12, 2022 (November 22, 2024) by JastMedia Overview The R&D department of one of the largest global semiconductor companies,specializing in a broad range of analog and digital connectivity products was experiencing high levels of scrap and low yields when shipping several of its IC chip products. They shipped multi-binned IC’s that ranged in size from 1x1mm up to 10x10mm with thickness dimensions […]Read More… from Shipping and Handling Multi-binned IC’s
Protecting Valuable Inkjet Print Heads During Shipping and Handling Posted on October 12, 2022 (November 22, 2024) by JastMedia Overview A leading manufacturer of high-value industrial inkjet print heads needed a method of securing and immobilizing print head components during shipping and handling. The company needed a carrier for three different components that comprised the print head. The average cost of each component was about $6,000 so it was important that the carrier provided […]Read More… from Protecting Valuable Inkjet Print Heads During Shipping and Handling
Gel-Pak Partners With BAE Systems On Solution For Costly Component-Out-Of-Pocket Defects Posted on April 9, 2021 (November 22, 2024) by JastMedia Problem / Application Many of today’s leading semiconductor manufacturers experience issues with thin compound semi die (<250μm) migrating out of the pockets of waffle pack trays during shipping. BAE Systems, a large international defense electronics company, has documented the high cost of RMAs, yield loss and rework labor associated with this die migration issue. Based […]Read More… from Gel-Pak Partners With BAE Systems On Solution For Costly Component-Out-Of-Pocket Defects
Gel-Pak Designs Texturized-Film Device Carrier Platform Posted on April 9, 2021 (November 22, 2024) by JastMedia Problem / Application Semiconductor companies and industrial manufacturers alike need a universal carrier to safely to handle delicate devices of varying sizes within factories and hold components with precision alignment. Both a large OSAT company (Silicon Photonics Chip) and an industrial automation company (QFN Packages) reached out to Delphon’s Gel-Pak division to design universal carrier […]Read More… from Gel-Pak Designs Texturized-Film Device Carrier Platform
Customized Textured Carrier Posted on November 19, 2019 (November 22, 2024) by JastMedia Problem / Application A large, long-standing customer approached Gel-Pak to discuss the possibility of a customized textured device carrier. Challenges/Requirements The customer faced unique manufacturing process challenges and was having difficulty sourcing a solution that would help them improve efficiency. The customer needed the product to handle a broad range of devices sizes on the […]Read More… from Customized Textured Carrier