LS4 Waffle Pack Lid

Gel-Pak LS4 4” Waffle Pack Lid

Shipping die (<600µm) in industry standard 4” waffle packs presents a challenge for many semiconductor manufacturers. Thin devices packaged in 4” waffle chip trays have a tendency to migrate out of pocket causing increased cost in rework labor and yield loss.

Gel-Pak’s LS4 padded waffle pack lid prevents die from migrating out of 4” waffle pack/chip tray pockets during shipping and handling. The LS4 lid, based on same technology as the patented LCS2 lid, is designed to work with Gel-Pak’s standard 4” clip which tightly compresses the tray and lid to prevent die migration.

• Eliminates die migration
• Saves significant costs associated with yield loss, rework labor and RMA’s caused by die migration issues.
• Protects die and substrates such as thin film capacitors, shims, RF switches, MMICs, pedestals, etc. from damage when shipped in industry standard waffle pack chip trays.
• Protects against scratches to thin film substrates and ceramics.
• Silicone free.