Product Spotlight

New Micro-Textured Film Enables Universal Bare Die Carriers

The emerging chiplet trend, which calls for the disaggregation of large monolithic functionality into interconnected smaller dies, offers significant advantages over the alternative system on chip (SoC). The move toward this technology has accentuated the need for known good die (KGD) that have been fully tested prior to integration into their final packaging. One challenge the industry faces in the test and assembly process is that conventional methods for handling chips can be problematic. A multitude of device dimensions and the need to pick and repick components or move them between processes calls for a more simplified way of handling these chiplets.
There is a need in the industry for a universal carrier to sidestep the need for molded trays with custom-designed pockets or carrier tapes that are only suitable for one-time use. Gel-Pak fills this gap with its well-known Vacuum Release™ tray technology, and most recently with a newly developed micro-textured film that can readily grip bare die without the need for pockets.