Gel-Pak Protecting the World’s Valuable Devices Highly Engineered Device Carriers and Films for Leading-Edge Technologies Solutions for Enhancing Manufacturing Yield and Efficiency Trusted Partner of the World’s Leading Semiconductor, Medical, and Electronic Device Manufacturers Products Find the right solution for your application Company Brochures, Datasheets, & Application Notes Datasheets, application notes, test reports and more Product Selection Wizard Find the right Gel-Pak product for your application. About Gel-Pak® Gel-Pak develops and manufactures a family of elastomer-based carriers and films designed to provide maximum protection during the shipping, handling, and processing of delicate devices. Our manufacturing expertise allows us to customize existing products or rapidly develop novel solutions to meet evolving requirements for next generation technologies. Learn More Explore Products Browse all Products VACUUM RELEASE TRAY™ Automated Die Handling Damage Free Shipping and Handling Pocketless Waffle Pack Learn More GEL-BOX® Pocketless Carrier Accommodates Variety of Device Sizes Immobilizes Components Learn More Gel-Probe Refine and Remove Probe Card Cleaning and Polishing Sheets and Wafers Extends Probe Card Life Increases uptime, Throughput, and Yield Learn More BTXF Textured Carriers Textured Universal Carrier Ideal for Internal Handling Available in 2”, 4” & JEDEC Sizes Learn More Your Innovation Partner Every product we create begins with a customer’s need. For over 40 years, Gel-Pak has cultivated a community of collaboration with our customers, to develop innovative solutions that empower them to change the world. Innovation Model Product Spotlight New Micro-Textured Film Enables Universal Bare Die Carriers The emerging chiplet trend, which calls for the disaggregation of large monolithic functionality into interconnected smaller dies, offers significant advantages over the alternative system on chip (SoC). The move toward this technology has accentuated the need for known good die (KGD) that have been fully tested prior to integration into their final packaging. One challenge the industry faces in the test and assembly process is that conventional methods for handling chips can be problematic. A multitude of device dimensions and the need to pick and repick components or move them between processes calls for a more simplified way of handling these chiplets. There is a need in the industry for a universal carrier to sidestep the need for molded trays with custom-designed pockets or carrier tapes that are only suitable for one-time use. Gel-Pak fills this gap with its well-known Vacuum Release™ tray technology, and most recently with a newly developed micro-textured film that can readily grip bare die without the need for pockets. Learn More Newsroom Posted on January 08, 2025 Gelpak to Showcase Innovations in Photonic Device Handling at Photonics West 2025 Company Leverages Extensive Collaborations with Photonics Industry Leaders to Address Evolving Market Requirements for Device Handling and Protection. Read More Posted on January 09, 2025 Protecting the Future: How Gel-Pak Safeguards Google’s Willow Quantum Computing Chip In the realm of quantum computing, Google’s Willow chip represents a significant leap forward. This chip, known for its advanced error correction and immense computational power Read More Posted on October 24, 2024 Victoria Tran And Tomonao Nakashima Present Joint Paper On Cleaning Innovations To Maximize OEE For High Volume Memory Test Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, is proud to announce that Dr. Victoria Tran Read More Product Selection Wizard Use the Product Selection Wizard to optimize your carrier solution.Gel-Pak provides both standard and custom products for thousands of customer device types and applications. Device Type Application Customer Requirements Your Gel-Pak Solution