Protecting the Future: How Gel-Pak Safeguards Google’s Willow Quantum Computing Chip Posted on January 8, 2025 (January 14, 2025) by JastMedia In the realm of quantum computing, Google’s Willow chip represents a significant leap forward. This chip, known for its advanced error correction and immense computational power, has demonstrated performance that paves the way for more advanced, large-scale quantum computing. Willow can solve problems in five minutes that would take the fastest supercomputers 10 septillion years. […]Read More… from Protecting the Future: How Gel-Pak Safeguards Google’s Willow Quantum Computing Chip
Silicon Carbide Materials Present Unique Shipping Requirements Posted on June 15, 2024 (November 8, 2024) by JastMedia Whether shipped as processed wafers, singulated die or fully packaged modules, all semiconductors have special transport requirements. Without the right carriers, they can easily become damaged. Each new material and substrate type poses new handling challenges. A prime example is compound semiconductors. Implementation of these devices is on the rise due to their wide bandgap, […]Read More… from Silicon Carbide Materials Present Unique Shipping Requirements
Collaboration: The Engine that Drives Innovation Posted on April 26, 2023 (November 8, 2024) by JastMedia By Joe Montano, President and CEO, Delphon “Great things in business are never done by one person; they’re done by a team of people.” Few in our industry would argue against this maxim, attributed to Steve Jobs. The reality is that true innovation is achieved not by one team but by multiple teams, leveraging each […]Read More… from Collaboration: The Engine that Drives Innovation
Chiplets’ Day Is Here, but Their Ecosystem Is Still Evolving Posted on January 19, 2023 (September 6, 2023) by JastMedia In the post-Moore’s Law era, chiplets – whose future implementation Gordon Moore also predicted – are expected to deliver high performance and area utilization, together with low power consumption and cost. Conceptually similar solutions, such as multi-chip modules and systems-on-chip, have been around for many years. The chiplet takes this concept a step further, creating […]Read More… from Chiplets’ Day Is Here, but Their Ecosystem Is Still Evolving
Keeping Delicate Medical Devices Safe During Handling and Shipping Posted on December 20, 2022 (September 6, 2023) by JastMedia Today’s medical devices often integrate delicate ICs or MEMS, or require incredibly small, intricate components. Advances in manufacturing allow design and fabrication of parts with fine resolution, down to micron-sized features. Such small feature sizes create key challenges for handling, inspection, sorting, and shipping these components. MEMS, with their combination of electronic and mechanical features […]Read More… from Keeping Delicate Medical Devices Safe During Handling and Shipping
Senate Votes to Advance Bill to Subsidize U.S.-Made Semiconductor Chips Posted on July 27, 2022 (December 19, 2022) by JastMedia By Amy B Wang and Jeanne Whalen The Senate voted Tuesday to advance a bill that would provide $52 billion in subsidies to domestic semiconductor manufacturers, as well as invest billions in science and technology innovation, in a bid to strengthen the United States’ competitiveness and self-reliance in what is seen as a keystone industry […]Read More… from Senate Votes to Advance Bill to Subsidize U.S.-Made Semiconductor Chips
Fixing the Bane of Costly Component Out Of Pocket Defects Posted on August 18, 2021 (September 6, 2023) by JastMedia The march of technological prog ress continues as traditionally bulky and discrete microwave devices become integrated in increasinglysmaller microelectronic modules and packages. New high performance GaN, GaAs, InP and other Class III-V and silicon semiconductor devices, along with high performance silicon variations such as SiC, are designed to push performance and enable new communications and […]Read More… from Fixing the Bane of Costly Component Out Of Pocket Defects
Mitigating the High Cost of Die Migration Posted on July 27, 2021 (September 6, 2023) by JastMedia By Darby Davis, Gel-Pak and Craig Blanchette, BAE Systems Expansion in the areas of SATCOM, automotive radar, 5G, and security are pushing high frequency semiconductor technologies toward smaller thinner footprints. These new high-performance Class III-V devices, made from materials such as GaN and GaAs, offer advanced features that enable a new generation of communication and […]Read More… from Mitigating the High Cost of Die Migration
Jeanne Beacham Featured in Concora Podcast Posted on June 3, 2021 (November 9, 2022) by JastMedia […]Read More… from Jeanne Beacham Featured in Concora Podcast
Many Chiplet Challenges Ahead Posted on April 12, 2021 (November 11, 2022) by JastMedia Assembling systems from physical IP is gaining mindshare, but there are technical, business and logistical issues that need to be resolved before this will work. Advanced packaging is seen as the most likely path to keep Moore’s Law going, but there are several challenges that have yet to be overcome — and several lurking pitfalls […]Read More… from Many Chiplet Challenges Ahead
Jeanne Beacham Viewpoint 2021 Posted on January 14, 2021 (November 8, 2024) by JastMedia Delphon CEO, Jeanne Beacham shares her thoughts about semiconductor and microelectronic industry trends for 2021. VIEWPOINT 2021: Jeanne Beacham, CEO, Delphon Industries To say that our industry’s landscape experienced a profound shift in 2020 is an understatement. Companies found themselves plunged from the familiar rhythm of day-to-day business, with carefully thought-out roadmaps, to a sea […]Read More… from Jeanne Beacham Viewpoint 2021
Chip Industry Dodges Direct Impact of Coronavirus Posted on February 19, 2020 (September 6, 2023) by JastMedia By Barbara Jorgensen Source: EE Times The semiconductor industry appears to have escaped the direct impact of the coronavirus crisis so far, but the market is likely to suffer the repercussions as the outbreak slows or suspends production among electronics manufacturers, according to Omdia. Despite facing logistical, packaging and test challenges related to the Covid-19 outbreak, […]Read More… from Chip Industry Dodges Direct Impact of Coronavirus
China Has Always Trailed the U.S. in Chipmaking. In the Trade War Era, Will It Finally Catch Up? Posted on November 15, 2019 (September 6, 2023) by JastMedia By Grady McGregor Source: Fortune, https://fortune.com/2019/11/15/us-china-trade-war-semiconductor-chips/ Can Tech Companies Bridge The Gap In The China-U.S. Trade War? Many tech companies are caught in the crossfire of the escalating trade and tech wars between China and the U.S. What are the fundamental issues that are dividing the two superpowers? China famously spends more on importing semiconductor […]Read More… from China Has Always Trailed the U.S. in Chipmaking. In the Trade War Era, Will It Finally Catch Up?
Engineers: 5G, connected cars and AI will greatly impact semiconductors in the next 3 years Posted on April 10, 2019 (September 6, 2023) by JastMedia There are a number of new technologies on the horizon that will influence the semiconductor industry in the next three years. But according to a new survey of engineers by Advanced Energy, the biggest impact on the chip market will come from 5G, connected vehicles and implementing artificial intelligence (AI) into workflows. The survey, conducted […]Read More… from Engineers: 5G, connected cars and AI will greatly impact semiconductors in the next 3 years
Semiconductor Slowdown Scare Could Be Shortsighted Posted on January 17, 2019 (September 6, 2023) by JastMedia By Kevin Curran Jan 17, 2019 | 12:24 PM EST The long-term demand bolstered by secular shifts in technology is keeping many on board the ship for semiconductors in the long term. Taiwan Semiconductor’s (TSM) poor forecast to kick of 2019 threatened to sink semiconductor stocks lower on Thursday, but analysts and investors are still […]Read More… from Semiconductor Slowdown Scare Could Be Shortsighted
Gallium Nitride Enabling IoT Revolution, Cellular 5G, Optoelectronics, and Sensors Posted on July 8, 2018 (September 6, 2023) by JastMedia IDST July 8, 2018 GaN is a semiconductor material that can amplify high power radio frequency signals efficiently at microwave frequencies to enhance a system’s range. Therefore it has become the technology of choice for high-RF power applications that require the transmission of signals over long distances such as EW, radar, base stations and satellite […]Read More… from Gallium Nitride Enabling IoT Revolution, Cellular 5G, Optoelectronics, and Sensors
5G: What is it good for? Posted on June 5, 2018 (September 6, 2023) by JastMedia By Larry Downes 5G, or 5th generation mobile, is the next big leap in wireless communications. You’ve probably heard about it in commercials or seen it in headlines. But much of the discussion about the new technology has been focused on its engineering features, infrastructure requirements and public policy considerations. With technical buzzwords like “network […]Read More… from 5G: What is it good for?
PDMS films for printed electronics – Methods and Advancements. Posted on March 1, 2018 (December 20, 2022) by JastMedia Dr. Victoria Tran, Delphon R&D Director delivered a talk about PDMS films at the recent FLEX Conference. Polydimethysiloxane (PDMS) is an attractive material for printed electronics. It is a soft, water impermeable dielectric and a familiar material for encapsulating and protecting electronics. In addition, PDMS is an ideal material for medical applications given its biocompatibility, […]Read More… from PDMS films for printed electronics – Methods and Advancements.
Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.5 Percent in 2018 Posted on February 12, 2018 (November 10, 2022) by JastMedia Worldwide semiconductor revenue is forecast to total $451 billion in 2018, an increase of 7.5 percent from $419 billion in 2017, according to Gartner, Inc. This represents a near doubling of Gartner’s previous estimate of 4 percent growth for 2018. “Favorable market conditions for memory sectors that gained momentum in the second half of 2016 […]Read More… from Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.5 Percent in 2018
Flexible, Stretchable Photonic Devices Developed Posted on February 7, 2018 (September 6, 2023) by JastMedia A new material produced by Juejun Hu and his team can be repeatedly stretched without losing its optical properties. Image: Courtesy of the researchers. Researchers at MIT and several other institutions have developed a method for making photonic devices – similar to electronic devices but based on light rather than electricity – that can bend […]Read More… from Flexible, Stretchable Photonic Devices Developed
Asia-Pacific, Eyes Photonics Market Growth Posted on August 8, 2017 (September 6, 2023) by JastMedia By Justine Murphy, Senior Editor. The ongoing development of manufacturing and telecommunications technologies, among others, is thrusting the industry to the top of the global goods market. Asia-Pacific, in particular, is expected to grow quickly and steadily. The global photonics market will continue its fervent growth in the coming years, according to a number of […]Read More… from Asia-Pacific, Eyes Photonics Market Growth
Semiconductor Sales Tracking up 21% From 2016 Posted on August 4, 2017 (September 6, 2023) by JastMedia By Dylan McGrath SAN FRANCISCO — Semiconductor sales are up nearly 21 percent year-to-date, punctuated by the highest ever sales total in the second quarter, according to the Semiconductor Industry Association (SIA). Chip sales for the second quarter totaled a record $97.9 billion, up 6 percent from the previous quarter and up 24 percent compared […]Read More… from Semiconductor Sales Tracking up 21% From 2016
Developing and Evaluating a Flexible Wireless Microcoil Array Based Integrated Interface for Epidural Cortical Stimulation Posted on March 29, 2017 (September 6, 2023) by JastMedia Xing Wang 1, Sharjeel A. Chaudhry 2, Wensheng Hou 1 and Xiaofeng Jia 3,4,5,6,7,* Key Laboratory of Biorheological Science and Technology, Ministry of Education, College of Bioengineering, Chongqing University, Chongqing 400044, China; wangxing@cqu.edu.cn (X.W.); w.s.hou@cqu.edu.cn (W.H.) School of Medicine and Health Sciences, George Washington University, Washington, DC 20037, USA; sharjeel@gwu.edu Department of Neurosurgery, University of […]Read More… from Developing and Evaluating a Flexible Wireless Microcoil Array Based Integrated Interface for Epidural Cortical Stimulation
Annual Laser Market Review & Forecast: Where have all the lasers gone? Posted on January 23, 2017 (September 6, 2023) by JastMedia Laser companies both small and large are feeling the recent surge of techsector M&A activity. Whether a timetomarket or portfolio expansion play, the details reveal much about where the laser industry is headed in the next decade—notwithstanding surprises related to Brexit or U.S. elections. GAIL OVERTON, ALLEN NOGEE, DAVID BELFORTE, and CONARD HOLTON Once considered […]Read More… from Annual Laser Market Review & Forecast: Where have all the lasers gone?
A sticky TEST but helpful situation for fragile medical devices Posted on January 20, 2017 (September 6, 2023) by JastMedia By Daphne Allen in Medical Packaging Components being loaded on Gel-Pak via pick & place equipment One stop on our Packaging Innovation Tour at MD&M Minneapolis 2016 was GelPak, a company offering a biocompatible gel that can be coated onto the bottom of boxes, trays, slides, and films to secure medical components in place during […]Read More… from A sticky TEST but helpful situation for fragile medical devices
Global Photonics Market Set for Growth Posted on November 10, 2016 (December 20, 2022) by JastMedia Photonics.com The global photonics market is set to reach $766 billion by 2020, according to a new report from Transparency Market Research. Expanding from 2013’s figure of $510 billion with a compound annual growth rate of 5.8 percent, the market’s growth is being driven by the demand for highly capable and efficient electronic products, as […]Read More… from Global Photonics Market Set for Growth
Wearables: The Next Big Technology Trend? Posted on September 13, 2016 (December 20, 2022) by JastMedia By: Prableen Bajpai Referenced Stocks: AAPL;FIT;GOOG;GOOGL;SNE;GRMN With the technology seeping deeper and deeper into our daily lives, the future of smart “wearables” looks bright. Wearables is a common term for devices or technology with features like scanners and sensors, and are, obviously, worn by a person. They come in different, such as clothes, spectacles, accessories, […]Read More… from Wearables: The Next Big Technology Trend?
Gel-Pak WF Film Used to Retrieve Bioparticles for Ultrasensitive Forensic DNA Profiling: Posted on June 13, 2016 (November 11, 2022) by JastMedia In forensics, it is sometimes necessary to retrieve genetic profiles from the microscopic amounts of biological material left behind in a crime. The “touch DNA” evidence that results from shed skin cells transferred from a person to an object or another person is typically recovered by using a cotton swab. However, there are limitations in […]Read More… from Gel-Pak WF Film Used to Retrieve Bioparticles for Ultrasensitive Forensic DNA Profiling:
Global Photonic Integrated Circuit (PIC) Industry Posted on March 11, 2016 (November 8, 2024) by JastMedia Source: (http://www.prnewswire.com/) From Reportlinker (http://www.prnewswire.com/news/reportlinker) NEW YORK, March 1, 2016 /PRNewswire/ — This report analyzes the worldwide markets for Photonic Integrated Circuit (PIC) in US$ Thousand. The Global market is further analyzed by the following Applications and Integration Methods: By Application – Optical Signal Processing, Optical Communications, and Others; By Integration Methods – Packaging, and […]Read More… from Global Photonic Integrated Circuit (PIC) Industry
The Dreaded “Antistatic Zone” Posted on February 18, 2016 (November 10, 2022) by JastMedia A Summary of Material Resistivity Classification Triboelectric Charge Generation is caused by the separation of materials. Charge generation can be caused by separating similar materials (film coming off a reel or tape off a roll) and dissimilar materials (lifting a package off a workbench). Prior to 1981, static control material was classified as to its […]Read More… from The Dreaded “Antistatic Zone”
The Semiconductor Industry’s Demographic Changes in 2016 Posted on December 24, 2015 (September 6, 2023) by JastMedia Changing demographic In the previous part of the series, we saw that the semiconductor industry entered into a phase of slow growth that sparked consolidation. In 2016, the demand is expected to revive in the Americas but slacken in the Asia-Pacific region. This is changing the demographics of the semiconductor industry. SEMI® 2015 Year-e nd […]Read More… from The Semiconductor Industry’s Demographic Changes in 2016
Deterministic transfer of two-dimensional materials by all-dry viscoelastic stamping Posted on November 17, 2015 (November 8, 2024) by JastMedia Andres Castellanos-Gomez *, Michele Buscema, Rianda Molenaar, Vibhor Singh, Laurens Janssen,Herre S. J. van der Zant and Gary A. Steele Kavli Institute of Nanoscience, Delft University of Technology, Lorentzweg 1, 2628 CJ Delft (The Netherlands). a.castellanosgomez@tudelft.nl ABSTRACT Deterministic transfer of two-dimensional crystals constitutes a crucial step towards the fabrication of heterostructures based on artificial stacking […]Read More… from Deterministic transfer of two-dimensional materials by all-dry viscoelastic stamping
Tips for Handling and Storing GaAs and MMIC Devices Posted on October 30, 2015 (November 11, 2022) by JastMedia Gel-Pak VR Trays are often the standard handling and storage method for GaAs and MMIC devices. The VR Products are membrane based trays that hold die in place during shipping and handling. They release components only when required. The surface contact between the die and the gel membrane on the tray surface has two independent […]Read More… from Tips for Handling and Storing GaAs and MMIC Devices
Semi-Automated Micro Assembly for Rapid Prototyping of a One DOF Surgical Wrist Posted on September 30, 2015 (September 6, 2023) by JastMedia Ranjana Sahai, Jusuk Lee, and Ronald S. Fearing{rsahai, ronf}@eecs.berkeley.eduDepartment of EECS, University of California, Berkeley, CA 94720. USA Abstract We have developed new methods for the automated assem- bly of prototype structures and we illustrate them with the construction of a simple one DOF 5mm surgical wrist em- ploying polyester flexures instead of revolute joints. […]Read More… from Semi-Automated Micro Assembly for Rapid Prototyping of a One DOF Surgical Wrist
Understanding ESD And EOS Failures In Semiconductor Devices Posted on July 30, 2015 (September 6, 2023) by JastMedia Static electricity can be defined as a stationary charge that builds up on the surface of a material. The interaction between stationary charges, known as electrostatics, leads to two key problems: electrostatic overstress (EOS) and electrostatic discharge (ESD). ESD Background Typically, ESD causes more than one-third of the field failures in the semiconductor industry. ESD-induced […]Read More… from Understanding ESD And EOS Failures In Semiconductor Devices
Global Semiconductor Market Outlook 2020 Posted on May 5, 2015 (December 20, 2022) by JastMedia NEW YORK, /PRNewswire/ The global semiconductor market has been experiencing a stimulating growth in recent times despite the industry suffering from a decline in revenue due to the economic downturn in 2010. Advancement in technology, emergences of mobile devices and consumer electronics, and new application areas are further expected to lead the global semiconductor market […]Read More… from Global Semiconductor Market Outlook 2020
Camera-guided Feeding of Optics in Robotbased Laser Assembly Posted on March 4, 2015 (September 7, 2023) by JastMedia Daniel Zontar1, Sebastian Haag1* and Christian Brecher2 Fraunhofer Institute for Production Technology IPT, Steinbachstr. 17, 52074 Aachen, Germany Head of the department of Production Machines at Fraunhofer Institute for Production Technology IPT and Chair at the Laboratory for Machine Tools and Production Engineering (WZL) at RWTH Aachen University, Steinbachstr. 19, 52074 Aachen, Germany * Corresponding […]Read More… from Camera-guided Feeding of Optics in Robotbased Laser Assembly