Many Chiplet Challenges Ahead

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Assembling systems from physical IP is gaining mindshare, but there are technical, business and logistical issues that need to be resolved before this will work.

Advanced packaging is seen as the most likely path to keep Moore’s Law going, but there are several challenges that have yet to be overcome — and several lurking pitfalls for the unaware. Some of these are technical, some business, and other just because the necessary skills are distributed today, meaning that there could be knowledge gaps created by silos.

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