BMP3E Bumped die carrier ☰ Quick Links × Quick Links E-Store Request Quote Request Sample Contact Technical Support Product Selection Wizard Calculate Number Of Devices/Carrier Gel-Pak Brochure VERTEC®BMP3E Bumped Device Carrier (BMP Series) Gel-Pak’s BMP products are ideal for use as a universal carrier for handling and transport of bumped devices. Based on our proprietary Vertec® material, the product uses a unique elastomer to hold components in place. For bumped die, flip chip and BGA handling. Protects fragile solder bumps during handling and transport. Flat film surface able to hold bumped devices “bump side down” and easily release. Compatible with automated pick & place equipment. Can be provided in multiple carrier form factors such as JEDEC standard trays, 2”, 4”, flat matrix or customer specific substrates. ESD version (static dissipative TPE technology). Request a Quote Request a Sample BMP3E For your specific device sizes refer to Die Calculator Program for determining the number of devices per box type. BMP3E Details BMP3E Applications Datasheets Resources BMP3E Sizes 2”, 4”, JEDEC Standard Tray, or Film Elastomer Proprietary White Vertec TPE Compatible Device Bump Height 60µm to 160µm Tray Configurations 2”, 4”, and JEDEC Black Conductive (Can also be purchased as a film) Surface Resistance > E10 (ohms) Storage Temperature -+10 to +50° C Printed Grids Available upon request Elastomer Color Available in white and black Shelf Life 2 Years Gel-Pak BMP3E carriers immobilize components in place during shipping hand handling. Bumped die Flip Chip BGA Packages Leaded Packages For your specific device sizes refer to Die Calculator Program for determining the number of devices per box type. Index #TD-113 DescriptionBMP Bumped Die Carrier AvailabilityDownload Index #TD-129 DescriptionBMP3E Die Carrier AvailabilityDownload Elastomer Technology Overview Product Selection Wizard Visit our Product Selection Wizard to find the right Gel-Pak for your Application. Visit Now!