Gel-Probe ReFine

Probe Tip Polishing Wafers and Sheets

Gel-Probe Refine wafers and sheets consist of a proprietary Gel elastomer polishing material uniformly blended with abrasive particles offered in sheet and 200mm/300mm wafer format.

  • Removes embedded and bonded debris from probe tips
  • Captures loose particles created during probing process
  • Lightly polishes the entire probe surface, tip length, and shaft in a non-destructive manner
  • Non-conductive, non-corrosive
  • Does not transfer residue to probes or bond pads
  • Exerts force on probes in only “Z” (vertical) direction and the force is less than that imparted during normal test conditions with no lateral force applied to probe tips
  • Standard and custom constructions available

Product Features

PRODUCT ABRASIVE LOADING OPERATING TEMP RELATIVE HARDNESS
Gel-Probe REFINE
L3
Low Load (~70%) 3µm SiC -60˚C to +200˚C 1.0
Gel-Probe REFINE
M3
Medium Load (~99%) 3µm SiC -60˚C to +200˚C 1.3
Gel-Probe REFINE
H3
High Load (~150%) 3µm SiC -60˚C to +200˚C 2.7
Gel-Probe REFINE
U3
Ultra-High Load (~300%) 3µm SiC -60˚C to +200˚C 5.4

Gel-Probe ReFine Polishing Wafer Cross Section

COVER SHEET - Peel off prior to use
POLISHING GEL Elastomer = 233µm
200mm WAFER 725µm -or-
300mm WAFER 775µm

*Graphic not to scale

Gel-Probe ReFine Polishing Sheets Cross Section

COVER SHEET - Peel off prior to use
POLISHING GEL Elastomer = 233µm
POLYIMIDE Backing
Adhesive PSA
Backside Release Liner - Peel off prior to use

*Graphic not to scale