New Micro-textured Film Enables Universal Bare Die Carrier Posted on July 8, 2022 (December 16, 2022) by JastMedia ☰ Quick Links × Quick Links E-Store Request Quote Request Sample Contact Technical Support Product Selection Wizard Calculate Number Of Devices/Carrier Gel-Pak Brochure By Raj Varma, Delphon CTO Jul 8, 2022 Gel-Pak’s new micro-textured film is featured in an article published in the July issue of Silicon Semiconductor The emerging chiplet trend, which calls for the disaggregation of large monolithic functionality into interconnected smaller dies, offers significant advantages over the alternative system on chip (SoC). The move toward this technology has accentuated the need for known good die (KGD) that have been fully tested prior to integration into their final packaging. One challenge the industry faces in the test and assembly process is that conventional methods for handling chips can be problematic. A multitude of device dimensions and the need to pick and repick components or move them between processes calls for a more simplified way of handling these chiplets. There is a need in the industry for a universal carrier to sidestep the need for molded trays with custom-designed pockets or carrier tapes that are only suitable for one-time use. Gel-Pak fills this gap with its well-known Vacuum Release™ tray technology, and most recently with a newly developed micro-textured film that can readily grip bare die without the need for pockets. The material is inspired by the bio-based dry adhesion found in nature with geckos, lizards, beetles, spiders, and ants. This article discusses Gel-Pak’s process around developing the ideal textures, fabrication process, and geometric patterns for this novel material, as well as its efficacy as an integrated circuit (IC) carrier. CONTINUE READING Gel-Pak's experienced technical support staff is available to answer your questions related to products or associated applications. Contact Us!