Silicon Carbide Materials Present Unique Shipping Requirements
Whether shipped as processed wafers, singulated die or fully packaged modules, all semiconductors have special transport requirements. Without the right carriers, they can easily become damaged. Each new material and substrate type poses new handling challenges....
Collaboration: The Engine that Drives Innovation
Delphon’s Gel-Pak division has a 40-year track record of collaborating with key industry leaders. Drawing on our deep expertise in polymer chemistry and engineering, our team collaborates with our customers’ and partners’ teams to fully understand their challenges...
Chiplets’ Day Is Here, but Their Ecosystem Is Still Evolving
In the post-Moore’s Law era, chiplets – whose future implementation Gordon Moore also predicted – are expected to deliver high performance and area utilization, together with low power consumption and cost....
Keeping Delicate Medical Devices Safe During Handling and Shipping
Today’s medical devices often integrate delicate ICs or MEMS, or require incredibly small, intricate components. Advances in manufacturing allow design and fabrication of parts with fine resolution, down to micron-sized features...
Senate Votes to Advance Bill to Subsidize U.S.-Made Semiconductor Chips
The Senate voted Tuesday to advance a bill that would provide $52 billion in subsidies to domestic semiconductor manufacturers, as well as invest billions in science and technology innovation, ...
Fixing the Bane of Costly Component Out Of Pocket Defects
The march of technological prog ress continues as traditionally bulky and discrete microwave devices become integrated in increasinglysmaller microelectronic modules and packages. New high performance GaN, GaAs, InP and other Class III-V and silicon semiconductor devices, along with high performance silicon variations such as SiC, are designed to push performance and enable new communications and sensing applications. ...
Mitigating the High Cost of Die Migration
Expansion in the areas of SATCOM, automotive radar, 5G, and security are pushing high frequency semiconductor technologies toward smaller thinner footprints.
Many Chiplet Challenges Ahead
Assembling systems from physical IP is gaining mindshare, but there are technical, business and logistical issues that need to be resolved before this will work.
Jeanne Beacham Viewpoint 2021
Delphon CEO, Jeanne Beacham shares her thoughts about semiconductor and microelectronic industry trends for 2021.
Chip Industry Dodges Direct Impact of Coronavirus
The semiconductor industry appears to have escaped the direct impact of the coronavirus crisis so far, but the market is likely to suffer the repercussions as the outbreak slows or suspends production among electronics manufacturers, according to Omdia.
China Has Always Trailed the U.S. in Chipmaking. In the Trade War Era, Will It Finally Catch Up?
Many tech companies are caught in the crossfire of the escalating trade and tech wars between China and the U.S. What are the fundamental issues that are dividing the two superpowers?
Engineers: 5G, connected cars and AI will greatly impact semiconductors in the next 3 years
There are a number of new technologies on the horizon that will influence the semiconductor industry in the next three years. But according to a new survey of engineers by Advanced Energy, the biggest impact on the chip market will come from 5G, connected vehicles and implementing artificial intelligence (AI) into workflows.
Semiconductor Slowdown Scare Could Be Shortsighted
Taiwan Semiconductor's (TSM) poor forecast to kick of 2019 threatened to sink semiconductor stocks lower on Thursday, but analysts and investors are still standing by their long term value.
Gallium Nitride Enabling IoT Revolution, Cellular 5G, Optoelectronics, and Sensors.
GaN is a semiconductor material that can amplify high power radio frequency signals efficiently at microwave frequencies to enhance a system’s range. Therefore it has become the technology of choice for high-RF power applications that require the transmission of signals over long distances such as EW, radar, base stations and satellite communications.
5G: What is it good for?
5G, or 5th generation mobile, is the next big leap in wireless communications. You’ve probably heard about it in commercials or seen it in headlines.
PDMS films for printed electronics - Methods and Advancements
Dr. Victoria Tran, Delphon R&D Director delivered a talk about PDMS films at the recent FLEX Conference.
Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.5 Percent in 2018
Worldwide semiconductor revenue is forecast to total $451 billion in 2018, an increase of 7.5 percent from $419 billion in 2017, according to Gartner, Inc. This represents a near doubling of Gartner's previous estimate of 4 percent growth for 2018.
Flexible, Stretchable Photonic Devices Developed
Researchers at MIT and several other institutions have developed a method for making photonic devices - similar to electronic devices but based on light rather than electricity - that can bend and stretch without damage. The devices could find uses in cables to connect computing devices, or in diagnostic and monitoring systems that could be attached to the skin or implanted in the body, flexing easily with the natural tissue.
Semiconductor Sales Tracking up 21% From 2016
Chip sales for the second quarter totaled a record $97.9 billion, up 6 percent from the previous quarter and up 24 percent compared with the second quarter of 2016, according to the SIA, which reports sales figures compiled by the World Semiconductor Trade Statistics (WSTS) organization.
Eyes Photonics Market Growth
The global photonics market will con-tinue its fervent growth in the com-ing years, according to a number of reports, as technology advances industry-wide. Progressing the most is the telecom-munications sector, which is expected to become the largest end-use industry for photonics because of rising demand or fiber optics components and systems. The manufacturing sector is booming, too, as lasers and other photonics-related technologies are replacing traditional machines and tools.
Wireless Medical Microcoil for Treatment of Stroke
Did you know that Gel-Pak is used to transport flexible microcoils. Check out how these devices can save lives...
Annual Laser Market Review & Forecast
Laser companies both small and large are feeling the recent surge of techsector M&A activity. Whether a timetomarket or portfolio expansion play, the det...
A Sticky but Helpful Situation for Fragile Medical Devices
One stop on our Packaging Innovation Tour at MD&M Minneapolis 2016 was Gel-Pak, a company offering a biocompatible gel that can be coated onto the bottom of ...
Global Photonics Market Set for Growth
ALBANY, N.Y., Nov. 14, 2016 — The global photonics market is set to reach $766 billion by 2020, according to a new report from Transparency Market Research...
Wearables: The Next Big Technolgy Trend?
With technology seeping deeper and deeper into our daily lives, the future of smart "wearables" looks bright. Wearables is a common term for devices or technology with features like scanners and sensors...
Gel-Pak WF Film Used in Forensic Applications
In forensics, it is sometimes necessary to retrieve genetic profiles from the microscopic amounts of biological material left behind in a crime. The “touch DNA” evidence that results from shed skin cells transferred from a person to an object or another person is typically recovered by using a cotton swab.
Global Photonic Integrated Circuit (PIC) Industry
NEW YORK, March 1, 2016 /PRNewswire/ -This report analyzes the worldwide markets for Photonic Integrated Circuit (PIC) in US$ Thousand. The Global market is further analyzed by the following Applications and Integration Methods: By Application - Optical Signal Processing, Optical Communications, and Others
Gel-Pak Film used for Crystal Vacuum Coating
The Gel-Pak DGL film product is a highly cross-lined polymer material designed for use in high temperature vacuum coating applications.
The Dreaded "Antistatic Zone"
Triboelectric charge generation is caused by the separation of materials. Charge generation can be caused by separating similar materials and dissimilar materials...
Semiconductor Industry Demographic Changes 2016:
In 2016 Semicondutor demand is expected to thrive in the Americas while it is expected to slow in Asia...
Gel-Pak PF Film used in fabrication of two-dimensional graphene material:
A research study produced by Kavli Institute of Nanoscience, Delft University of Technology, The Netherlands, explains the processes of transferring two-dimensional graphene material using Gel-Pak's PF film.
Tips for Handling and Storing GaAs and MMIC Components
GaAs and MMIC device manufacturers commonly use Gel-Pak VR carriers to handle and store their components.
Gel-Pak PF Film Used for Semi-Automated Micro Assembly
Gel-Pak PF Film is used as an enabling material auto-assembly technique designed by UC Berkeley department of EECS.
Understanding EOS and ESD Failures in Semiconductor Devices
Static Electricity can be defined as stationary charge that builds up on the surface of a material. The interaction between stationary charges, known as electrostatics, leads to two key problems: electrostatic overstress (EOS) and electrostatic discharge (ESD).
Global Semiconductor Outlook 2020
The global semiconductor market has been experiencing a stimulating growth in recent times despite the industry suffering from a decline in revenue due to the economic downturn in 2010. Advancement in technology, emergences of mobile devices and consumer electronics, and new application areas are further expected to lead the global semiconductor market in the coming years.
Thermal Slide debonding for High-yield Thin Wafer Results
Gel-Pak product helps increase yield of thin wafers... Thermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage originate during upstream bonding material coating, curing, bonding, and thinning processes. Moreover, only thermal separation tools that are highly precise and highly accurate will consistently render desirable process yields. The bonded pair is subjected to many thermal and compressive forces during processing and debonding. The thinned device layers are often very sensitive to outside factors including temperature, vacuum, and mechanical compression and release
Camera-guided Feeding of Optics in Robot-based Laser Assembly
Gel-Pak Vacuum Release Trays aid in part feeding optics in robot-based assembly process. This paper discusses the assembly of laser systems and the fact that a good share of the process must be