Gel-Pak Thought Leaders Take the Stage with Podium Presentations on Scalable Test and Advanced Device Handling

HAYWARD, Calif., February, 2026 — Gel-Pak®, a Delphon Company, and a global leader in advanced handling and packaging solutions for high-tech manufacturing, announced today that two of its senior leaders delivered podium presentations this month, reinforcing Gel-Pak’s leadership in semiconductor packaging, test, and manufacturing innovation.

Jerry Broz, PhD, Vice President of Strategic Marketing & Business Development, presented at the FormFactor COMPASS 2026 event in Tokyo, where he delivered a podium presentation titled “Efficiency Gains in Advanced Wafer-Level and Die-Level Test: Challenges and Solutions.” His talk addressed the growing demands placed on test operations by advanced device architectures and highlighted strategies for improving overall equipment effectiveness (OEE) through optimized handling and test flows.

Raj Varma, Chief Technology Officer, presented at the SMTA Wafer Level Packaging Symposium in San Francisco, where his podium presentation, “Universal Handling Solutions and Advanced Test Strategies: Enabling Scalable Heterogeneous Integration,” explored the technical challenges associated with heterogeneous integration and the need for robust, damage-free handling solutions that scale with manufacturing complexity.

Together, the presentations showcased Gel-Pak’s ability to bridge market insight and deep technical expertise—from identifying emerging industry challenges to delivering proven, high-performance solutions that support next-generation semiconductor manufacturing.

“Industry leadership is about more than innovation—it’s about sharing knowledge that helps move the entire ecosystem forward,” said , Delphon CEO, Joe Montano. “These presentations allowed us to engage directly with the test and packaging community on real-world challenges and practical paths to improvement.”

“As device architectures continue to evolve, scalable handling and test strategies become critical,” said Joe Montano. “Our focus is on enabling customers to protect increasingly complex devices while maintaining throughput, yield, and long-term manufacturing efficiency.”

Gel-Pak’s dual podium presence this month underscores the company’s commitment to thought leadership, innovation, and customer partnership across semiconductor, microelectronics, and other high-reliability markets.

About Gel-Pak

Gel-Pak®, a Delphon Company, provides advanced handling and packaging solutions for the semiconductor, microelectronics, medical device, and cleanroom manufacturing industries. Gel-Pak’s portfolio of gel-based carriers and protective solutions helps customers protect sensitive components, improve yields, and enable scalable manufacturing worldwide.