Semiconductor companies and industrial manufacturers alike need a universal carrier to safely to handle delicate devices of varying sizes within factories and hold components with precision alignment. Both a large OSAT company (Silicon Photonics Chip) and an industrial automation company (QFN Packages) reached out to Delphon’s Gel-Pak division to design universal carrier platforms for multiple sized components.
Many of today’s leading semiconductor manufacturers experience issues with thin compound semi die (<250μm) migrating out of the pockets of waffle pack trays during shipping. BAE Systems, a large international defense electronics company, has documented the high cost of RMAs, yield loss and rework labor associated with this die migration issue.
A leading manufacturer of high-value industrial inkjet print heads needed a method of securing andimmobilizing print head components during shipping and handling.
The R&D department of one of the largest global semiconductor companies,specializing in a broad range of analog and digital connectivity products was experiencing high levels of scrap and low yields when shipping several of its IC chip products.
The world’s largest supplier of optical communication products required a special carrier for their small Optical Sub-Assembly (OSA) manufacturing process. Their OSA device, which is comprised of many small, fragile passive and active components, is a high-end product that enables 100GHz infrastructure.
One of the Asia’s premier GaAs foundries, offering high speed GaAs MMIC’s (monolithic microwave ICs) and RFIC’s (radio frequency ICs) had been working to get their PA (power amplifier) chips qualified by a leading US semiconductor manufacturer for use in Apple’s iPhone products. The GaAs foundry was required to make several large shipments of KGD (known good die) to the manufacturer for evaluation in order to complete the qualification process. It was critical that they found a device carrier that would protect the fragile GaAs die during shipping.
A worldwide leader in the manufacturing of optical and photonic products approached Gel-Pak in search of a solution to safely handle large volumes of their highly-polished Planar Lightwave Circuit (PLC) devices. This silicon photonic device is part of an optical transceiver to enable 100G Ethernet.ping.