NEW LCS2 Lid / Clip Super System ☰ Quick Links × Quick Links E-Store Request Quote Request Sample Contact Technical Support Product Selection Wizard Calculate Number Of Devices/Carrier Gel-Pak Brochure Prototypes now available for qualification Developed in partnership with BAE Systems, Gel-Pak’s patent pending Lid/Clip Super System (LCS2) prevents thin semiconductor die from migrating out of waffle pack/chip tray pockets during shipping and handling. The lid is designed to work with a new highly engineered clip that uniformly compresses the tray and lid together. For more detailed information, please visit the following links: Product Information Product Datasheet Case Study Product Video: ASME 2021 BAE Presentation, Eliminate Costly Component Out of Pocket Conditions: CMSE 2021 Gel-Pak Presentation: New Lid/Clip Super System LCS2: Please visit Cleanroom Tape for additional information. Visit Now!