NEW LCS2 Lid / Clip Super System

☰ Quick Links

Prototypes now available for qualification

Developed in partnership with BAE Systems, Gel-Pak’s patent pending Lid/Clip Super System (LCS2) prevents thin semiconductor die from migrating out of waffle pack/chip tray pockets during shipping and handling. The lid is designed to work with a new highly engineered clip that uniformly compresses the tray and lid together.

Lid/Clip Super System

For more detailed information, please visit the following links:

Product Video:

ASME 2021 BAE Presentation, Eliminate Costly Component Out of Pocket Conditions:

CMSE 2021 Gel-Pak Presentation: New Lid/Clip Super System LCS2:

Please visit Cleanroom Tape for additional information.

Visit Now!