Gel‑Pak to Showcase Advanced Device‑Handling Solutions and Present Technical Paper at the IMAPS Device Packaging Conference

Hayward, CA — Feb 28, 2025 — Gel‑Pak, a Delphon company and a leader in innovative device-handling and protection solutions, announced today that it will exhibit at the IMAPS Device Packaging Conference, taking place March 3–6, 2025, at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona.

At this year’s event, Gel‑Pak will highlight its expanding portfolio of high‑performance carrier technologies designed to help semiconductor manufacturers improve operational efficiency, streamline workflows, and increase yield across advanced packaging environments.

Booth Exhibit: Next‑Generation Device‑Handling Technologies

Visitors to the Gel‑Pak booth will have the opportunity to explore the company’s latest advancements in:

• Universal, pocketless carriers engineered to handle a wide variety of device sizes
• Micro‑textured film carriers designed to stabilize and protect delicate singulated die
• Reusable, sustainable carrier platforms that reduce waste while supporting automation
• High‑performance solutions that enhance throughput and minimize device damage during test, transport, and assembly

These solutions reflect Gel‑Pak’s ongoing mission to deliver engineered materials that solve the evolving challenges of today’s heterogeneous integration and advanced packaging workflows.

Jerry Broz to Deliver Technical Presentation on Universal Carrier Innovation

Gel‑Pak is also proud to announce that Dr. Jerry Broz, Vice President of Business Development and Strategic Marketing, will present an invited technical paper titled: “Driving Process Agility and Innovation for Advanced Packaging: Role of Universal Carriers for Singulated Die”

In this session, Dr. Broz will discuss how universal carrier technology plays a critical role in enabling:

• Process agility across multiple device generations and packaging approaches
• Flexible, reliable handling of singulated die in both manual and automated workflows
• Reduced reliance on single‑use, custom‑molded trays, simplifying logistics and supporting sustainability initiatives
• Faster adoption of chiplet‑based architectures, heterogeneous integration, and other advanced packaging strategies

The presentation will outline how universal carriers help semiconductor manufacturers overcome long‑standing device‑handling challenges while supporting the industry’s transition to more agile and scalable processes.

About Gel‑Pak

For over 45 years, Gel‑Pak has partnered with high‑technology companies to create advanced materials and device‑handling solutions that protect, transport, and process high‑value components. From delicate semiconductor die to photonics, medical devices, and precision‑engineered parts, Gel‑Pak products are trusted worldwide for their quality, reliability, and performance.

As part of Delphon, Gel‑Pak leverages deep expertise in elastomer engineering, cleanroom manufacturing, and global materials innovation to support customers that are transforming the world.