Gel-Pak to Showcase Next-Generation Device Handling Solutions at Photonics West 2026

Company Unveils Textured Universal Carrier and Highlights BTXF Technology for Advanced Photonic Device Protection

HAYWARD, Calif., December 8, 2025 — Gel-Pak, a Delphon company and global leader in advanced materials and device handling solutions, is excited to announce its participation at Photonics West 2026, taking place January 20–22 in San Francisco, CA. Gel-Pak will debut its latest innovation: a textured Universal Carrier available in multiple form factors, designed to address the evolving needs of the photonics industry.

The new Universal Carrier leverages Gel-Pak’s expertise in elastomer technologies to provide secure, residue-minimizing handling for a wide range of device sizes and shapes. Its unique microtextured surface ensures optimal holding force while allowing for easy removal by hand or automated equipment—eliminating the need for customized pocketed trays and accelerating high-volume manufacturing.

A highlight of Gel-Pak’s newest offerings will be the BTXF Universal Handling Trays, Wafers, and Films, engineered for in-process and shipping applications. The products’ proprietary microtextured elastomer securely holds components with less than 2% surface contact, minimizing contamination and protecting even the most fragile photonic devices. Available in 2”, 4”, and JEDEC tray formats, as well as wafers and film sheets, BTXF is compatible with both manual and automated handling environments.

Key Benefits of BTXF Technology:

• Universal Fit: Accommodates a variety of device sizes on a single carrier—no customization required.
• Clean and Safe: Free of silicone and phthalates, with ultra-low outgassing for critical environments.
• Minimal Contact: Less than 2% of the device area touches the film, reducing residue and safeguarding sensitive surfaces.
• Prevents Costly Die Migration: The stable, pocketless design eliminates device movement during handling and shipping, preventing die migration that can lead to machine downtime, rework, and yield loss. This stability is especially critical for high-value, miniaturized devices.
• Delivers Instant ROI: By eliminating die migration and the need for custom tooling, BTXF carriers streamline production, reduce labor and equipment costs, and maximize device yields—delivering immediate return on investment for manufacturers.
• Versatile Applications: Ideal for die handling during test, pre-assembly kitting, component integration, movement between operations, shipping and more.
• Multiple Form Factors: Available as trays (2”, 4”, JEDEC, large format) Wafers, and Films for maximum flexibility.

Gel-Pak’s legacy of collaboration with industry leaders continues to drive innovation in device protection and process efficiency. “Our commitment to developing advanced materials and collaborating with customers enables us to deliver solutions that keep pace with the rapid evolution of photonic technologies,” said Joe Montano, President and CEO of Delphon.

About Gel-Pak

Gel-Pak manufactures a family of polymer-based carriers and films designed to provide maximum protection during the shipping, handling, and processing of delicate devices. With over 45 years of experience and ISO-certified manufacturing facilities, Gel-Pak delivers both standard and customized solutions for the world’s most valuable devices. For more information, visit https://www.gelpak.com.

About Delphon

Delphon is a portfolio of companies focused on advanced materials for critical environments, supporting customers in semiconductor, medical, and electronics industries. Learn more at https://www.delphon.com.

Visit Gel-Pak at Booth #1562 at Photonics West 2026, January 20–22, or contact Jennifer Nunes, Sr. Director, Marketing, at jnunes@delphon.com.