Gel-Pak Fall 2026 Technical Conference and Event Schedule Posted on August 19, 2026 (August 19, 2026) by JastMedia ☰ Quick Links × Quick Links E-Store Request Quote Request Sample Contact Technical Support Product Selection Wizard Calculate Number Of Devices/Carrier Gel-Pak Brochure This fall, Gel-Pak will participate in industry conferences, technical forums, exhibitions, and educational programs focused on semiconductor testing, advanced packaging, photonics, and device handling technologies. From technical presentations and poster sessions to exhibitions and customer meetings, our team will be sharing expertise and connecting with industry professionals across North America, Europe, and Asia. September SEMICON Taiwan September 2-6 | Taipei, Taiwan Gel-Pak representatives will attend SEMICON Taiwan to meet with customers, industry partners, and technology leaders focused on semiconductor manufacturing, advanced packaging, and test applications. Regional partners Hakuto and HTW will support customer engagement activities throughout the event. China International Optoelectronic Exposition (CIOE) September 9-11 | Shenzhen, China Gel-Pak will participate in CIOE, one of the world’s largest photonics and optoelectronics exhibitions. The event provides an opportunity to meet with customers developing optical components, photonic devices, and advanced technology applications requiring specialized device handling and protection solutions. ATV User Group Meeting September 9 Jerry Broz, Ph.D., Vice President of Strategic Marketing and Business Development, will deliver a technical presentation focused on maintaining probe card performance and emerging cleaning technologies for MEMS probe cards. The session will include case studies demonstrating how advanced probe cleaning solutions can improve overall equipment effectiveness (OEE), increase test yield, and enhance probe card performance consistency. RF, Photonics & Semiconductor Test Technical Forum September 10 | Albuquerque, New Mexico Gel-Pak will join MicroSanj, Keysight Technologies, MPI Corporation, and Focus Microwaves for a free one-day technical forum focused on the latest advances in RF, photonics, semiconductor device characterization, measurement, and testing. Hosted at the Nuclear Science & History Museum, the event will provide engineers and researchers with insights into the technologies driving next-generation semiconductor and photonic device development. ISTest Workshop September 14-15 Dr. Broz will share technical findings related to probe card maintenance and advanced cleaning technologies for MEMS probe cards. His presentation will feature case studies validating the effectiveness of modern probe cleaning approaches and demonstrating their impact on equipment utilization, probe performance, manufacturing productivity, and semiconductor test yield. IMAPS International Symposium September 29 – October 2 Gel-Pak will contribute technical content through a paper and poster presentation focused on advanced packaging and electronics manufacturing technologies. The symposium brings together engineers, researchers, and industry leaders developing next-generation microelectronics solutions. October European Microwave Week (EuMW) October 9-12 Gel-Pak products will be represented by European distributor Teltec at one of the industry’s premier events for RF, microwave, and photonics technologies. Attendees will have the opportunity to learn more about Gel-Pak solutions for handling and protecting sensitive electronic and photonic devices. SEMICON West / Test Vision Symposium October 9-12 Gel-Pak representatives will attend SEMICON West while Dr. Broz presents a technical poster focused on semiconductor test applications, probe card performance, and technologies designed to improve test efficiency and yield. PSECE October 26-28 Gel-Pak will participate in PSECE while regional partner ACCELTEST showcases Gel-Probe® technology and related semiconductor test solutions for engineers and manufacturers throughout Southeast Asia. November SWTest Asia November 5-6 Gel-Pak will exhibit and deliver a technical presentation focused on hybrid probe cleaning technologies and their role in improving probe card reliability, reducing maintenance-related downtime, and increasing semiconductor test yield. SEMICON Europa November 10-13 Gel-Pak personnel will meet with customers and industry partners at SEMICON Europa, working alongside distributor Teltec to showcase solutions for semiconductor device handling, advanced packaging, and test applications. December SEMICON Japan December 9-11 Gel-Pak will maintain its presence in the Japanese semiconductor market through customer engagements and support from regional distribution partners attending the event. The conference remains an important venue for connecting with leaders in semiconductor manufacturing and advanced packaging technologies. Connect with Gel-Pak Whether through technical presentations, poster sessions, exhibitions, or customer meetings, Gel-Pak remains committed to helping semiconductor manufacturers improve device handling, maintain probe performance, increase yield, and enhance operational efficiency. We look forward to connecting with customers, partners, and industry professionals throughout the Fall 2026 event season. Gel-Pak's experienced technical support staff is available to answer your questions related to products or associated applications. Contact Us!
