NDT/B-CC-00B-XT

Device/Application Data

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• Device Size
• Device Measurement Units * milsinchesmmum
• Select Backside RoughnessPolished (i.e. Glass)Etched (i.e. Backgrind)Porous (i.e. Ceramic)Non-Flat (i.e. Bumped)
• Unload Method * Tweezers/FingersPen-Vac/Vacuum WandAutomated Equipment
• Select Industry *AerospaceAutomotiveConsumerData Storage (Disk Drive)EducationMedical/DentalPharmaceuticalPhotonicsRF/WirelessSemiconductor