​Gel-Pak Wafer/Large Format VR Plates™

Wafer/Large Format VR Plates™are ideal for:

• Full or partial wafers and substrates ranging from 75mm to 450mm.
• Applications where contact with top surface or edges must be avoided.
• Diced wafers on film frames.
• Handling thin, high value substrates such as fragile InP wafers, GaAs wafers, AFM wafers, MEMs wafers.

How a Wafer/Large Format Plate works

The product is based on the exact same Gel-Pak Vacuum Release® Technology as the VR trays, except the VR surface (Gel & Mesh) is built on a larger flat plate instead of inside a molded tray. These VR Plates can be purchased separately or with an outer container box for storage protection.

A special version of the large format carrier is available to transport 200mm and 300mm wafers mounted on a film frame. When diced, the VR Plate immobilizes the unexpanded die to prevent potential edge damage.

Custom VR plate sizes can be designed and manufactured to meet your specific requirements.

Configurations

• Gel retention levels of XT, XL, and X4 available to accommodate variations in device size, weight and surface roughness. X8 is available as a special order.
• VR Plates are manufactured using special Process B Gel material.
• Standard Mesh size is 16, but 33 Mesh is also available upon request.
• VR Plates available in brown phenolic (C) or transparent acrylic (T) material.
• Storage boxes available in either conductive black (C) or transparent (T) material.
• Custom prints artwork (grids, company name, logo, etc) can be created upon request.

Related Products:

A special VP-900 vacuum fixture is available for use with the VR-900 series vacuum plates products or the standard VHP-24 or VRS-24 vacuum fixtures can be used in combination with the VR-900 Template.