Your chips are precious cargo.
Make sure they arrive safely.
Compound semiconductor chips keep getting thinner and standard waffle packs just aren’t designed to contain them. The result? Die migration. At Gel-Pak, we designed the Lid Clip Super System (LCS2™) to eliminate component out-of-pocket defects resulting from die migration. It features a patented lid clip system that delivers uniform compression across the entire lid. Static dissipative materials provide enhanced electrostatic discharge protection. Your valuable devices arrive defect-free and ready for assembly.
Count on the LCS2 to:
- Prevent die migration defects
- Keep thin die in place
- Provide protection from jostling during transport
- Improve final yield
- Save time and money
- Eliminate troubleshooting and rework
