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Wafer/Large Substrate VR Carriers
The Wafer/Large Substrate VR Carrier products were developed in response to the semiconductor industry's trend toward larger, thinner and higher value wafers and substrates. For wafers/substrates 3" x 3" or smaller in size, the standard VR trays can still be successfully used, but when the dimensions exceed 3", a large substrate VR carrier is required. This product line extends the VR technology for use with substrates as large as 300 mm.
The product is based on the same Gel-Pak Vacuum Release® technology as the VR trays, except the VR surface (Gel / mesh) is built on a flat plate instead of on a molded tray. The standard plate material is either phenolic or transparent acrylic and is placed in a conductive black or a transparent hinged box for storage protection. Available as a single VR plate in a box, multiple wafers/substrates in a single container, or as a stand alone VR plate (no box) format.
The large carriers are extensively used for shipping fragile InP wafers, GaAs wafers, AFM wafers, MEM's wafers and other valuable substrates to avoid contact with top surface or edges. The standard mesh size used on all large substrate VR plates is 16 and the Gel retention level is XL due to the large components typically involved. Size 33 mesh or higher retention levels are available upon request.
A special version of the large format carrier was developed to transport 8" and 12" wafers still mounted on a film frame. When diced, the die edges are highly fragile in this not expanded format and the large VR carrier immobilizes the die to prevent potential edge chipping.
A special VP-900 vacuum fixture has been developed for use with the VR-900 series vacuum plates products or the standard VHP-24 or VRS-24 vacuum fixtures can be used in combination with the VR-900 Template.
Custom VR plate sizes can be designed and manufactured to meet your specific requirements.
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