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Vacuum Release Products
Gel-Pak's patented Vacuum Release (VR) series of products utilizes an innovative technology to safely handle fragile devices of all sizes, ranging from small transistors and laser diodes (12um) to large ICs and wafers (300mm).The surface of the Vacuum Release carrier is built using the proprietary Gel material with an optimized retention level to securely hold the devices, but unlike the traditional products, the devices can be released from the Gel surface "on demand" by applying vacuum to the underside of the tray.  Vacuum Release is recommended for all automated handling processes and for applications where manually unloading the device with tweezers might cause damage. In these cases, the VR technology is required to safely unload the device. The vacuum force is only used when unloading devices. For loading, simply place the device on the Gel surface same as how the Gel-Box, Gel-Tray, and Gel-Slides are used. Vacuum is not required for loading the VR products. The standard 2" and 4" VR tray products are well suited for high-speed automated die handling equipment (die attach, wire bond, pick and place, etc.) or for when the devices can be manually loaded and unloaded using a vacuum pen. The 4" VR Tray can hold devices up to 3" x 3" in size. For larger devices such as wafers or substrates, the Wafer/Large Substrate Vacuum Release product is available. VR trays are the perfect technology for shipping Known Good Die, especially when automated handling is involved. All of the alternative carrier methods have their limitations; Waffle Packs
 Click on one of the links below to learn more: |
 2" VR Tray  4" VR-Tray (VR-44)  Wafer/Large Substrate VR Carrier |
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Sitemap Gel-Pak 31398 Huntwood Ave., Hayward CA 94544 Phone 510.576.2220 Fax 510.576.2282 © Copyright 2006, Delphon Industries. |
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