Gel-Pak: Gel-Film®

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Gel-Film^®

The Gel-Film® products are manufactured using the same proprietary Gel material and is offered in 3 different product configurations: WF, PF, and DGL. The most commonly used Gel-Film product is the WF film which is Gel bonded to a metalized polyester substrate material and it is available with an optional pressure sensitive adhesive backing (-A).

WF film is used for a wide assortment of applications such as:

Probe Tip Cleaning
Wafer Backgrinding
Disk Drive Bar Lapping
Surface Protection
Polishing Optics
Process Handling Fixtures
Scribe and Break cover sheet
Flex circuit laser cutting
Flat panel display cover
Cover sheet for handling fragile wafers
Micro displays and lenses

The WF Gel-Film comes in several retention levels and Gel thickness combinations.

The PF and DGL films are similar to the WF product except the Gel material is not bonded to a substrate allowing the Gel film material to be easily removed from the backing material, otherwise known as "free Gel." These products are typically used for special process applications.

The DGL film is a Process B version of Gel which is laminated onto a thinner polyethylene backing. The primary applications for DGL film is special process handling and as a coversheet during the Scribe & Break process to capture loose debris and particles during the break step.

Gel-Film is available in standard pre-cut sizes or can be sold in custom shapes and sizes per your specific requirements.

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